JPH02120616U - - Google Patents
Info
- Publication number
- JPH02120616U JPH02120616U JP2684889U JP2684889U JPH02120616U JP H02120616 U JPH02120616 U JP H02120616U JP 2684889 U JP2684889 U JP 2684889U JP 2684889 U JP2684889 U JP 2684889U JP H02120616 U JPH02120616 U JP H02120616U
- Authority
- JP
- Japan
- Prior art keywords
- base material
- heat medium
- medium circulation
- heating device
- laid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000002023 wood Substances 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 3
- 238000009408 flooring Methods 0.000 claims 1
- 238000009434 installation Methods 0.000 claims 1
- 239000012774 insulation material Substances 0.000 claims 1
Description
第1図は本考案床暖房装置の設置状態を示す断
面図、第2図は要部の拡大断面図、第3図は分解
して示す斜視図、第4図は従来の床暖房装置の一
例を示す断面図である。
1:建物の床板、2:断熱材、3:熱媒循環パ
イプ、4:溝、5:木質系基材、6:木質系フロ
アー材。
Figure 1 is a sectional view showing the installed state of the floor heating system of the present invention, Figure 2 is an enlarged sectional view of the main parts, Figure 3 is an exploded perspective view, and Figure 4 is an example of a conventional floor heating system. FIG. 1: Building floorboards, 2: Heat insulating materials, 3: Heat medium circulation pipes, 4: Grooves, 5: Wood base material, 6: Wood floor materials.
Claims (1)
上に敷設され、上面には熱媒体を通過せしめる熱
媒循環パイプを配管するための溝を凹設した木質
系基材と、上記基材上面の溝に嵌込み状に沿わせ
て配管された熱媒循環パイプと、上記熱媒循環パ
イプを覆つて基材上に敷設された木質系フロアー
材とからなることを特徴とする床暖房装置。 (2) 基材及びフロアー材が間伐材を用いて製造
されていることを特徴とする請求項(1)記載の床
暖房装置。 (3) 断熱材上への基材の敷設、基材への溝の凹
設、溝への熱媒循環パイプの配管、基材上へのフ
ロアー材の敷設が全て設置現場において施工され
ることを特徴とする請求項(1)記載の床暖房装置
。[Scope of Claim for Utility Model Registration] (1) A heat insulating material laid on the floorboard, and a groove laid on the above heat insulating material, with a groove recessed in the upper surface for piping a heat medium circulation pipe through which the heat medium passes. a wooden base material, a heat medium circulation pipe installed along the groove on the top surface of the base material, and a wood floor material laid on the base material covering the heat medium circulation pipe; A floor heating device characterized by comprising: (2) The floor heating device according to claim (1), wherein the base material and the floor material are manufactured using thinned wood. (3) Laying the base material on top of the insulation material, creating grooves in the base material, piping heat medium circulation pipes to the grooves, and laying the flooring material on the base material must all be carried out at the installation site. The floor heating device according to claim (1), characterized in that:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2684889U JPH02120616U (en) | 1989-03-08 | 1989-03-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2684889U JPH02120616U (en) | 1989-03-08 | 1989-03-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02120616U true JPH02120616U (en) | 1990-09-28 |
Family
ID=31248844
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2684889U Pending JPH02120616U (en) | 1989-03-08 | 1989-03-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02120616U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0474207U (en) * | 1990-11-01 | 1992-06-29 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5844283A (en) * | 1981-09-09 | 1983-03-15 | Hitachi Ltd | Package type air compressor |
JPS60218536A (en) * | 1984-04-13 | 1985-11-01 | 洪 起華 | Board for woody system heat accumulating panel |
-
1989
- 1989-03-08 JP JP2684889U patent/JPH02120616U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5844283A (en) * | 1981-09-09 | 1983-03-15 | Hitachi Ltd | Package type air compressor |
JPS60218536A (en) * | 1984-04-13 | 1985-11-01 | 洪 起華 | Board for woody system heat accumulating panel |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0474207U (en) * | 1990-11-01 | 1992-06-29 |
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