JPH02118966U - - Google Patents
Info
- Publication number
- JPH02118966U JPH02118966U JP2687089U JP2687089U JPH02118966U JP H02118966 U JPH02118966 U JP H02118966U JP 2687089 U JP2687089 U JP 2687089U JP 2687089 U JP2687089 U JP 2687089U JP H02118966 U JPH02118966 U JP H02118966U
- Authority
- JP
- Japan
- Prior art keywords
- land
- thick film
- pellet mounting
- bonding
- bonding land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 claims 2
- 239000010409 thin film Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2687089U JPH02118966U (es) | 1989-03-08 | 1989-03-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2687089U JPH02118966U (es) | 1989-03-08 | 1989-03-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02118966U true JPH02118966U (es) | 1990-09-25 |
Family
ID=31248884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2687089U Pending JPH02118966U (es) | 1989-03-08 | 1989-03-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02118966U (es) |
-
1989
- 1989-03-08 JP JP2687089U patent/JPH02118966U/ja active Pending