JPH02118964U - - Google Patents
Info
- Publication number
- JPH02118964U JPH02118964U JP2765389U JP2765389U JPH02118964U JP H02118964 U JPH02118964 U JP H02118964U JP 2765389 U JP2765389 U JP 2765389U JP 2765389 U JP2765389 U JP 2765389U JP H02118964 U JPH02118964 U JP H02118964U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- solder
- circuit board
- printed circuit
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims 3
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2765389U JPH02118964U (id) | 1989-03-10 | 1989-03-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2765389U JPH02118964U (id) | 1989-03-10 | 1989-03-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02118964U true JPH02118964U (id) | 1990-09-25 |
Family
ID=31250329
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2765389U Pending JPH02118964U (id) | 1989-03-10 | 1989-03-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02118964U (id) |
-
1989
- 1989-03-10 JP JP2765389U patent/JPH02118964U/ja active Pending