JPH02118938U - - Google Patents
Info
- Publication number
- JPH02118938U JPH02118938U JP2687189U JP2687189U JPH02118938U JP H02118938 U JPH02118938 U JP H02118938U JP 2687189 U JP2687189 U JP 2687189U JP 2687189 U JP2687189 U JP 2687189U JP H02118938 U JPH02118938 U JP H02118938U
- Authority
- JP
- Japan
- Prior art keywords
- board
- integrated circuit
- circuit device
- hybrid integrated
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2687189U JPH02118938U (pt) | 1989-03-08 | 1989-03-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2687189U JPH02118938U (pt) | 1989-03-08 | 1989-03-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02118938U true JPH02118938U (pt) | 1990-09-25 |
Family
ID=31248886
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2687189U Pending JPH02118938U (pt) | 1989-03-08 | 1989-03-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02118938U (pt) |
-
1989
- 1989-03-08 JP JP2687189U patent/JPH02118938U/ja active Pending