JPH02117075U - - Google Patents
Info
- Publication number
- JPH02117075U JPH02117075U JP2701689U JP2701689U JPH02117075U JP H02117075 U JPH02117075 U JP H02117075U JP 2701689 U JP2701689 U JP 2701689U JP 2701689 U JP2701689 U JP 2701689U JP H02117075 U JPH02117075 U JP H02117075U
- Authority
- JP
- Japan
- Prior art keywords
- filter
- divided
- pressure regulator
- powder
- extension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005192 partition Methods 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Coating Apparatus (AREA)
- Thermistors And Varistors (AREA)
Description
第１図は本考案の一実施例の斜視図である。
１……箱、２……フイルタ、３……仕切り板、
４……圧縮空気送気管、４１……送気管開口部、
６……空気圧調整器、７……粉体樹脂。
４……圧縮空気送気管、４１……送気管開口部、
６……空気圧調整器、７……粉体樹脂。
Claims (1)
- 粉体樹脂浴槽の水平な底面をなすフイルタがフ
イルタ面に垂直な仕切り板により複数の領域に分
割され、フイルタの下方の仕切り板の延長部によ
り分割された空間にそれぞれ、空気圧調整器を備
えた圧縮空気送気管がフイルタに向かつて開口し
ていることを特徴とする粉体モールド装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2701689U JPH078055Y2 (ja) | 1989-03-09 | 1989-03-09 | 粉体モールド装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2701689U JPH078055Y2 (ja) | 1989-03-09 | 1989-03-09 | 粉体モールド装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02117075U true JPH02117075U (ja) | 1990-09-19 |
| JPH078055Y2 JPH078055Y2 (ja) | 1995-03-01 |
Family
ID=31249158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2701689U Expired - Fee Related JPH078055Y2 (ja) | 1989-03-09 | 1989-03-09 | 粉体モールド装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH078055Y2 (ja) |
-
1989
- 1989-03-09 JP JP2701689U patent/JPH078055Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH078055Y2 (ja) | 1995-03-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |