JPH02116761U - - Google Patents
Info
- Publication number
- JPH02116761U JPH02116761U JP2605489U JP2605489U JPH02116761U JP H02116761 U JPH02116761 U JP H02116761U JP 2605489 U JP2605489 U JP 2605489U JP 2605489 U JP2605489 U JP 2605489U JP H02116761 U JPH02116761 U JP H02116761U
- Authority
- JP
- Japan
- Prior art keywords
- flexible substrate
- film
- protrusions
- reinforcing plate
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 230000003014 reinforcing effect Effects 0.000 claims 2
- 238000005452 bending Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図、第２図は本考案のそれぞれ一実施例に
おけるフレキシブル基板の平面図及び断面図、第
３図は従来のフレキシブル基板の平面図及び断面
図、第４図は屈曲動作を説明するための断面図で
ある。
１１ａ……ベースフイルム、１１ｂ……オーバ
ーレイフイルム、１２……補強板、１２ａ……端
部、１２ｂ，１２ｃ……突部、１２ｄ，１２ｅ…
…テーパー部、１３……パターン。
1 and 2 are a plan view and a sectional view of a flexible substrate according to an embodiment of the present invention, FIG. 3 is a plan view and a sectional view of a conventional flexible substrate, and FIG. 4 is for explaining the bending operation. FIG. 11a...Base film, 11b...Overlay film, 12...Reinforcement plate, 12a...End portion, 12b, 12c...Protrusion, 12d, 12e...
...Tapered part, 13...pattern.
Claims (1)
イルムに補強板を貼り付けて成るフレキシブル基
板において、パターンの配線方向に少なくとも１
つ以上の突部を補強板に形成し、前記パターンを
この突部を避けて配線したことを特徴とするフレ
キシブル基板。 In a flexible substrate in which a wiring pattern is formed on a film and a reinforcing plate is attached to this film, at least one
1. A flexible substrate, characterized in that three or more protrusions are formed on a reinforcing plate, and the pattern is routed avoiding the protrusions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2605489U JPH02116761U (en) | 1989-03-07 | 1989-03-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2605489U JPH02116761U (en) | 1989-03-07 | 1989-03-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02116761U true JPH02116761U (en) | 1990-09-19 |
Family
ID=31247330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2605489U Pending JPH02116761U (en) | 1989-03-07 | 1989-03-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02116761U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0492669U (en) * | 1990-12-26 | 1992-08-12 | ||
| JP2007165490A (en) * | 2005-12-13 | 2007-06-28 | Nitto Denko Corp | Wiring circuit board with reinforcing plate |
| WO2019102833A1 (en) * | 2017-11-22 | 2019-05-31 | アルプスアルパイン株式会社 | Input device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5171962A (en) * | 1974-12-18 | 1976-06-22 | Sumitomo Electric Industries | KATOSEIPURINTOK AIROBAN |
-
1989
- 1989-03-07 JP JP2605489U patent/JPH02116761U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5171962A (en) * | 1974-12-18 | 1976-06-22 | Sumitomo Electric Industries | KATOSEIPURINTOK AIROBAN |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0492669U (en) * | 1990-12-26 | 1992-08-12 | ||
| JP2007165490A (en) * | 2005-12-13 | 2007-06-28 | Nitto Denko Corp | Wiring circuit board with reinforcing plate |
| WO2019102833A1 (en) * | 2017-11-22 | 2019-05-31 | アルプスアルパイン株式会社 | Input device |