JPH02115221U - - Google Patents
Info
- Publication number
- JPH02115221U JPH02115221U JP2376489U JP2376489U JPH02115221U JP H02115221 U JPH02115221 U JP H02115221U JP 2376489 U JP2376489 U JP 2376489U JP 2376489 U JP2376489 U JP 2376489U JP H02115221 U JPH02115221 U JP H02115221U
- Authority
- JP
- Japan
- Prior art keywords
- grommet
- diameter hole
- waterproof structure
- hot melt
- melt adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004831 Hot glue Substances 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
Landscapes
- Installation Of Indoor Wiring (AREA)
- Insulating Bodies (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2376489U JPH0724744Y2 (ja) | 1989-03-03 | 1989-03-03 | グロメットの防水構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2376489U JPH0724744Y2 (ja) | 1989-03-03 | 1989-03-03 | グロメットの防水構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02115221U true JPH02115221U (uk) | 1990-09-14 |
JPH0724744Y2 JPH0724744Y2 (ja) | 1995-06-05 |
Family
ID=31243029
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2376489U Expired - Lifetime JPH0724744Y2 (ja) | 1989-03-03 | 1989-03-03 | グロメットの防水構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0724744Y2 (uk) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009123573A (ja) * | 2007-11-16 | 2009-06-04 | Yazaki Corp | シール材の充填方法およびシール材の充填装置 |
JP2010250973A (ja) * | 2009-04-10 | 2010-11-04 | Sumitomo Wiring Syst Ltd | シールド線端末の止水構造 |
-
1989
- 1989-03-03 JP JP2376489U patent/JPH0724744Y2/ja not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009123573A (ja) * | 2007-11-16 | 2009-06-04 | Yazaki Corp | シール材の充填方法およびシール材の充填装置 |
JP2010250973A (ja) * | 2009-04-10 | 2010-11-04 | Sumitomo Wiring Syst Ltd | シールド線端末の止水構造 |
Also Published As
Publication number | Publication date |
---|---|
JPH0724744Y2 (ja) | 1995-06-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |