JPH02114960U - - Google Patents
Info
- Publication number
- JPH02114960U JPH02114960U JP2433589U JP2433589U JPH02114960U JP H02114960 U JPH02114960 U JP H02114960U JP 2433589 U JP2433589 U JP 2433589U JP 2433589 U JP2433589 U JP 2433589U JP H02114960 U JPH02114960 U JP H02114960U
- Authority
- JP
- Japan
- Prior art keywords
- insulating member
- conductive connecting
- package
- connecting member
- surface mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2433589U JPH02114960U (en, 2012) | 1989-03-02 | 1989-03-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2433589U JPH02114960U (en, 2012) | 1989-03-02 | 1989-03-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02114960U true JPH02114960U (en, 2012) | 1990-09-14 |
Family
ID=31244093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2433589U Pending JPH02114960U (en, 2012) | 1989-03-02 | 1989-03-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02114960U (en, 2012) |
-
1989
- 1989-03-02 JP JP2433589U patent/JPH02114960U/ja active Pending