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Publication date
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Priority to JP1989022308UpriorityCriticalpatent/JPH02114932U/ja
Publication of JPH02114932UpublicationCriticalpatent/JPH02114932U/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/10—Bump connectors; Manufacturing methods related thereto
H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
H01L2224/13001—Core members of the bump connector
H01L2224/13005—Structure
H01L2224/13006—Bump connector larger than the underlying bonding area, e.g. than the under bump metallisation [UBM]
