JPH0211373U - - Google Patents
Info
- Publication number
- JPH0211373U JPH0211373U JP9014888U JP9014888U JPH0211373U JP H0211373 U JPH0211373 U JP H0211373U JP 9014888 U JP9014888 U JP 9014888U JP 9014888 U JP9014888 U JP 9014888U JP H0211373 U JPH0211373 U JP H0211373U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- slit
- bonding
- slits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000008878 coupling Effects 0.000 claims description 8
- 238000010168 coupling process Methods 0.000 claims description 8
- 238000005859 coupling reaction Methods 0.000 claims description 8
Description
第１図は本考案によるプリント基板の結合構造
の一実施例を示す分解斜視図、第２図は該実施例
の適用例を示す斜視図、第３図Ａ，Ｂは該実施例
の組立て工程図、第４図は本考案における突起の
他の構造例を示す部分正面図、第５図ないし第７
図は本考案の他の実施例を示す断面図、第８図お
よび第９図は従来のプリント基板の結合構造を示
す断面図である。
Fig. 1 is an exploded perspective view showing an embodiment of a printed circuit board coupling structure according to the present invention, Fig. 2 is a perspective view showing an application example of the embodiment, and Figs. 3A and B are assembly steps of the embodiment. Figure 4 is a partial front view showing other structural examples of the protrusion in the present invention, and Figures 5 to 7 are
The figure is a sectional view showing another embodiment of the present invention, and FIGS. 8 and 9 are sectional views showing a conventional printed circuit board connection structure.
Claims (1)
対して垂直をなす結合板を介して結合する構造で
あつて、結合板の第１、第２のプリント基板にそ
れぞれ対する結合面に係止片を突設すると共に、
第１のプリント基板に対する結合面に突起を形成
し、前記第１のプリント基板には、対応する結合
面に設けられた係止片と突起をそれぞれ挿入、嵌
合するスリツトを、両スリツトの間隔を係止片と
突起の間隔と異ならせて設け、第２のプリント基
板には、対応する結合面に形成された係止片を挿
入するスリツトを設けてなり、前記結合板の両結
合面に形成された各係止片の各対応スリツトへの
挿入とスリツト長手方向への移動により係止片が
スリツト縁に係止されると共に、前記突起が対応
する前記突起嵌合用スリツトに嵌合されて両プリ
ント基板が結合されることを特徴とするプリント
基板の結合構造。 ２ 請求項１における前記両プリント基板の少な
くともいずれかに対応する結合板の結合面に２つ
以上の係止片を設け、該結合面に対応するプリン
ト基板に、各係止片挿入用の複数個のスリツトを
設けたことを特徴とするプリント基板の結合構造
。 ３ 請求項１または２における前記第２のプリン
ト基板に対応する結合板の結合面にも突起を設け
、第２のプリント基板に、該結合面に設けられた
係止片と突起をそれぞれ挿入、嵌合するスリツト
を、前記同様に両スリツトの間隔を係止片と突起
の間隔と異ならせて設けたことを特徴とするプリ
ント基板の結合構造。[Claims for Utility Model Registration] 1. A structure in which two printed circuit boards are coupled to each other via a coupling plate that is perpendicular to the printed circuit boards, wherein the coupling plate has a structure that connects the first and second printed circuit boards to each other. In addition to providing a protruding locking piece on the joining surface,
A protrusion is formed on the coupling surface to the first printed circuit board, and the first printed circuit board has a slit into which the locking piece and the protrusion provided on the corresponding coupling surface are inserted and fitted, respectively, and a gap between the two slits is formed. are provided at different intervals from the spacing between the locking pieces and the protrusions, the second printed circuit board is provided with a slit into which the locking pieces formed on the corresponding bonding surfaces are inserted, and the second printed circuit board is provided with slits into which the locking pieces formed on the corresponding bonding surfaces are inserted; By inserting each formed locking piece into each corresponding slit and moving it in the longitudinal direction of the slit, the locking piece is locked to the slit edge, and the projection is fitted into the corresponding projection fitting slit. A printed circuit board bonding structure characterized in that both printed circuit boards are bonded. 2. Two or more locking pieces are provided on the bonding surface of the bonding plate corresponding to at least one of the two printed circuit boards according to claim 1, and a plurality of locking pieces for inserting each locking piece are provided on the printed circuit board corresponding to the bonding surface. A printed circuit board bonding structure characterized by having individual slits. 3. Protrusions are also provided on the coupling surface of the coupling plate corresponding to the second printed circuit board according to claim 1 or 2, and the locking pieces and the protrusions provided on the coupling surface are respectively inserted into the second printed circuit board, A bonding structure for printed circuit boards, characterized in that the slits to be fitted are provided so that the spacing between the slits is different from the spacing between the locking piece and the protrusion, as described above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9014888U JPH0211373U (en) | 1988-07-07 | 1988-07-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9014888U JPH0211373U (en) | 1988-07-07 | 1988-07-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0211373U true JPH0211373U (en) | 1990-01-24 |
Family
ID=31314680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9014888U Pending JPH0211373U (en) | 1988-07-07 | 1988-07-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0211373U (en) |
-
1988
- 1988-07-07 JP JP9014888U patent/JPH0211373U/ja active Pending
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