JPH0211355U - - Google Patents

Info

Publication number
JPH0211355U
JPH0211355U JP8896988U JP8896988U JPH0211355U JP H0211355 U JPH0211355 U JP H0211355U JP 8896988 U JP8896988 U JP 8896988U JP 8896988 U JP8896988 U JP 8896988U JP H0211355 U JPH0211355 U JP H0211355U
Authority
JP
Japan
Prior art keywords
thermally conductive
conductive spring
detecting element
circulating
fitting part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8896988U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8896988U priority Critical patent/JPH0211355U/ja
Publication of JPH0211355U publication Critical patent/JPH0211355U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は第２図の要部拡大図、第２図は本考案
の一実施例縦断面図、第３図は外筒を取り外した
状態の第２図の一部省略斜視図である。 １０……真空冷却容器、１２……循環冷却機、
１４……外筒、１６……内筒、２２……環状セラ
ミツク基板、２４……赤外線検知素子、２８……
熱伝導性バネ、３４，３６……金属箔。 1 is an enlarged view of the main part of FIG. 2, FIG. 2 is a longitudinal sectional view of an embodiment of the present invention, and FIG. 3 is a partially omitted perspective view of FIG. 2 with the outer cylinder removed. 10... Vacuum cooling container, 12... Circulating cooler,
14... Outer tube, 16... Inner tube, 22... Annular ceramic substrate, 24... Infrared detection element, 28...
Thermal conductive spring, 34, 36...metal foil.

Claims (1)

【実用新案登録請求の範囲】 赤外線検知素子２４を熱伝導性バネ２８を介し
て循環冷却機１２に嵌合・搭載した循環冷却型赤
外線検知器において、 循環冷却機１２と熱伝導性バネ２８の嵌合部及
び熱伝導性バネ２８と赤外線検知素子２４の嵌合
部に展延性のある金属箔３４，３６を挟んだこと
を特徴とする循環冷却型赤外線検知器の冷却嵌合
構造。[Scope of Claim for Utility Model Registration] In a circulating cooling type infrared detector in which an infrared detecting element 24 is fitted and mounted on a circulating cooler 12 via a thermally conductive spring 28, A cooling fitting structure for a circulating cooling type infrared detector characterized in that malleable metal foils 34 and 36 are sandwiched between the fitting part and the fitting part of the thermally conductive spring 28 and the infrared detecting element 24.
JP8896988U 1988-07-06 1988-07-06 Pending JPH0211355U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8896988U JPH0211355U (en) 1988-07-06 1988-07-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8896988U JPH0211355U (en) 1988-07-06 1988-07-06

Publications (1)

Publication Number Publication Date
JPH0211355U true JPH0211355U (en) 1990-01-24

Family

ID=31313522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8896988U Pending JPH0211355U (en) 1988-07-06 1988-07-06

Country Status (1)

Country Link
JP (1) JPH0211355U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007274569A (en) * 2006-03-31 2007-10-18 National Univ Corp Shizuoka Univ Imaging apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007274569A (en) * 2006-03-31 2007-10-18 National Univ Corp Shizuoka Univ Imaging apparatus

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