JPH02113268U - - Google Patents
Info
- Publication number
- JPH02113268U JPH02113268U JP2192489U JP2192489U JPH02113268U JP H02113268 U JPH02113268 U JP H02113268U JP 2192489 U JP2192489 U JP 2192489U JP 2192489 U JP2192489 U JP 2192489U JP H02113268 U JPH02113268 U JP H02113268U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- connection
- spring
- circuit
- springs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000002788 crimping Methods 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2192489U JPH02113268U (de) | 1989-02-27 | 1989-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2192489U JPH02113268U (de) | 1989-02-27 | 1989-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02113268U true JPH02113268U (de) | 1990-09-11 |
Family
ID=31239584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2192489U Pending JPH02113268U (de) | 1989-02-27 | 1989-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02113268U (de) |
-
1989
- 1989-02-27 JP JP2192489U patent/JPH02113268U/ja active Pending
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