JPH02110647U - - Google Patents
Info
- Publication number
- JPH02110647U JPH02110647U JP1723789U JP1723789U JPH02110647U JP H02110647 U JPH02110647 U JP H02110647U JP 1723789 U JP1723789 U JP 1723789U JP 1723789 U JP1723789 U JP 1723789U JP H02110647 U JPH02110647 U JP H02110647U
- Authority
- JP
- Japan
- Prior art keywords
- refrigerant
- passage
- polymer
- die header
- sealing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920000642 polymer Polymers 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 4
- 239000003507 refrigerant Substances 0.000 claims 4
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
Description
第１図はこの考案に係るシール装置のポリマー
吐出状態時を示す縦断正面図、第２図は同じくポ
リマー吐出停止時の縦断正面図、第３図はポリマ
ーの循環路を付加した状態の説明図、第４図は従
来のシール装置を示す正面図である。
１１……リアクター、１２……ダイケーシング
、１３……ポリマー吐出路、１５……ダイヘツダ
、１６……コツク、１７……コツク本体、２０…
…シール部分、２１……通路。
Fig. 1 is a longitudinal sectional front view showing the sealing device according to this invention when the polymer is being discharged, Fig. 2 is a longitudinal sectional front view when the polymer discharging is stopped, and Fig. 3 is an explanatory diagram of the state in which a polymer circulation path is added. , FIG. 4 is a front view showing a conventional sealing device. DESCRIPTION OF SYMBOLS 11... Reactor, 12... Die casing, 13... Polymer discharge path, 15... Die header, 16... Kotoku, 17... Kotoku body, 20...
...Seal part, 21...Passage.
Claims (1)
行なうコツクを設置し、このコツクに、コツクの
表面温度を低下させ、コツクとシール部の間に固
化ポリマーを発生させて、シールを行なう冷媒体
の通路を設けたダイヘツダのシール装置。 A refrigerant passage is installed at the top of the die header to open and close the polymer discharge passage, and this refrigerant passage is installed to lower the surface temperature of the refrigerant and generate solidified polymer between the refrigerant and the sealing part to seal. Die header sealing device equipped with
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1723789U JPH0627632Y2 (en) | 1989-02-16 | 1989-02-16 | Die header sealing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1723789U JPH0627632Y2 (en) | 1989-02-16 | 1989-02-16 | Die header sealing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02110647U true JPH02110647U (en) | 1990-09-04 |
| JPH0627632Y2 JPH0627632Y2 (en) | 1994-07-27 |
Family
ID=31230841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1723789U Expired - Lifetime JPH0627632Y2 (en) | 1989-02-16 | 1989-02-16 | Die header sealing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0627632Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0376718A (en) * | 1989-08-18 | 1991-04-02 | Michiharu Tatsumi | Molding apparatus of polymer |
-
1989
- 1989-02-16 JP JP1723789U patent/JPH0627632Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0376718A (en) * | 1989-08-18 | 1991-04-02 | Michiharu Tatsumi | Molding apparatus of polymer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0627632Y2 (en) | 1994-07-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |