JPH02110376U - - Google Patents
Info
- Publication number
- JPH02110376U JPH02110376U JP1930489U JP1930489U JPH02110376U JP H02110376 U JPH02110376 U JP H02110376U JP 1930489 U JP1930489 U JP 1930489U JP 1930489 U JP1930489 U JP 1930489U JP H02110376 U JPH02110376 U JP H02110376U
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- printed wiring
- multilayer printed
- wiring board
- prepreg material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 4
- 239000011162 core material Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は、本考案の一実施例を示す斜視図（説
明図）である。第２図は、第１図の実施例の縦断
面図である。
１……多層プリント配線板、２ａ，２ｂ……外
層材、３，５……プリプレグ、３ａ，３ｂ，３ｃ
，５ａ，５ｂ……プリプレグの素材板、４……内
層コア材。
FIG. 1 is a perspective view (illustrative diagram) showing an embodiment of the present invention. FIG. 2 is a longitudinal sectional view of the embodiment of FIG. 1. 1... Multilayer printed wiring board, 2a, 2b... Outer layer material, 3, 5... Prepreg, 3a, 3b, 3c
, 5a, 5b... prepreg material plate, 4... inner layer core material.
Claims (1)
グにおいて、プリプレグの素材板の厚みごとに異
なる着色を施したことを特徴とする多層プリント
配線板のプリプレグ。 A prepreg for a multilayer printed wiring board, which is inserted between the layers of a multilayer printed wiring board, and is characterized in that the prepreg material is colored differently depending on the thickness of the prepreg material board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1930489U JPH02110376U (en) | 1989-02-21 | 1989-02-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1930489U JPH02110376U (en) | 1989-02-21 | 1989-02-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02110376U true JPH02110376U (en) | 1990-09-04 |
Family
ID=31234695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1930489U Pending JPH02110376U (en) | 1989-02-21 | 1989-02-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02110376U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008129815A1 (en) * | 2007-03-30 | 2008-10-30 | Sumitomo Bakelite Co., Ltd. | Prepreg with carrier, method for manufacturing the prepreg, multilayered printed wiring board, and semiconductor device |
-
1989
- 1989-02-21 JP JP1930489U patent/JPH02110376U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008129815A1 (en) * | 2007-03-30 | 2008-10-30 | Sumitomo Bakelite Co., Ltd. | Prepreg with carrier, method for manufacturing the prepreg, multilayered printed wiring board, and semiconductor device |
| JP5370149B2 (en) * | 2007-03-30 | 2013-12-18 | 住友ベークライト株式会社 | Prepreg with carrier and manufacturing method thereof, multilayer printed wiring board, and semiconductor device |