JPH02110343U - - Google Patents
Info
- Publication number
- JPH02110343U JPH02110343U JP1970589U JP1970589U JPH02110343U JP H02110343 U JPH02110343 U JP H02110343U JP 1970589 U JP1970589 U JP 1970589U JP 1970589 U JP1970589 U JP 1970589U JP H02110343 U JPH02110343 U JP H02110343U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- insulating layer
- copper foil
- rolled copper
- aluminum plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000000059 patterning Methods 0.000 claims 1
- 238000004382 potting Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1970589U JPH02110343U (US07943777-20110517-C00090.png) | 1989-02-22 | 1989-02-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1970589U JPH02110343U (US07943777-20110517-C00090.png) | 1989-02-22 | 1989-02-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02110343U true JPH02110343U (US07943777-20110517-C00090.png) | 1990-09-04 |
Family
ID=31235452
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1970589U Pending JPH02110343U (US07943777-20110517-C00090.png) | 1989-02-22 | 1989-02-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02110343U (US07943777-20110517-C00090.png) |
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1989
- 1989-02-22 JP JP1970589U patent/JPH02110343U/ja active Pending