JPH02110333U - - Google Patents
Info
- Publication number
- JPH02110333U JPH02110333U JP2048389U JP2048389U JPH02110333U JP H02110333 U JPH02110333 U JP H02110333U JP 2048389 U JP2048389 U JP 2048389U JP 2048389 U JP2048389 U JP 2048389U JP H02110333 U JPH02110333 U JP H02110333U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- semiconductor wafer
- fixed
- polishing
- negative pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2048389U JPH02110333U (en, 2012) | 1989-02-22 | 1989-02-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2048389U JPH02110333U (en, 2012) | 1989-02-22 | 1989-02-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02110333U true JPH02110333U (en, 2012) | 1990-09-04 |
Family
ID=31236891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2048389U Pending JPH02110333U (en, 2012) | 1989-02-22 | 1989-02-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02110333U (en, 2012) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012016758A (ja) * | 2010-07-06 | 2012-01-26 | Disco Corp | 研削装置 |
-
1989
- 1989-02-22 JP JP2048389U patent/JPH02110333U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012016758A (ja) * | 2010-07-06 | 2012-01-26 | Disco Corp | 研削装置 |