JPH02110333U - - Google Patents

Info

Publication number
JPH02110333U
JPH02110333U JP2048389U JP2048389U JPH02110333U JP H02110333 U JPH02110333 U JP H02110333U JP 2048389 U JP2048389 U JP 2048389U JP 2048389 U JP2048389 U JP 2048389U JP H02110333 U JPH02110333 U JP H02110333U
Authority
JP
Japan
Prior art keywords
wafer
semiconductor wafer
fixed
polishing
negative pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2048389U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2048389U priority Critical patent/JPH02110333U/ja
Publication of JPH02110333U publication Critical patent/JPH02110333U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2048389U 1989-02-22 1989-02-22 Pending JPH02110333U ( )

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2048389U JPH02110333U ( ) 1989-02-22 1989-02-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2048389U JPH02110333U ( ) 1989-02-22 1989-02-22

Publications (1)

Publication Number Publication Date
JPH02110333U true JPH02110333U ( ) 1990-09-04

Family

ID=31236891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2048389U Pending JPH02110333U ( ) 1989-02-22 1989-02-22

Country Status (1)

Country Link
JP (1) JPH02110333U ( )

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012016758A (ja) * 2010-07-06 2012-01-26 Disco Corp 研削装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012016758A (ja) * 2010-07-06 2012-01-26 Disco Corp 研削装置

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