JPH02109907U - - Google Patents
Info
- Publication number
- JPH02109907U JPH02109907U JP1808089U JP1808089U JPH02109907U JP H02109907 U JPH02109907 U JP H02109907U JP 1808089 U JP1808089 U JP 1808089U JP 1808089 U JP1808089 U JP 1808089U JP H02109907 U JPH02109907 U JP H02109907U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- heating panel
- plate
- paper
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 12
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- 239000000057 synthetic resin Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000004744 fabric Substances 0.000 claims 1
- 239000004745 nonwoven fabric Substances 0.000 claims 1
- 229920001568 phenolic resin Polymers 0.000 claims 1
- 239000005011 phenolic resin Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229920005749 polyurethane resin Polymers 0.000 claims 1
- 239000011148 porous material Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 238000003856 thermoforming Methods 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 229920006337 unsaturated polyester resin Polymers 0.000 claims 1
- 239000002759 woven fabric Substances 0.000 claims 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
Landscapes
- Surface Heating Bodies (AREA)
- Resistance Heating (AREA)
- Central Heating Systems (AREA)
Description
第1図は本考案の暖房パネル1の構成断面図、
第2図は、該暖房パネル1が床暖房に利用された
場合の構成断面図、第3図は、暖房壁掛パネルに
利用された場合の斜視断面図である。
1…暖房パネル、2…板状発熱体、3…導電材
料が分散された無機質板状成形体、4…電極、5
…合成樹脂系絶縁層、6…断熱材、7…床仕上げ
材、8…化粧層、9…取付け用額縁。
FIG. 1 is a sectional view of the configuration of the heating panel 1 of the present invention.
FIG. 2 is a sectional view of the heating panel 1 when used for floor heating, and FIG. 3 is a perspective sectional view when the heating panel 1 is used as a wall-mounted heating panel. DESCRIPTION OF SYMBOLS 1 ... Heating panel, 2 ... Plate-shaped heating element, 3... Inorganic plate-shaped molded body in which conductive material is dispersed, 4... Electrode, 5
...Synthetic resin insulation layer, 6. Heat insulating material, 7. Floor finishing material, 8. Decorative layer, 9. Picture frame for installation.
Claims (1)
無機質系板状成形体に電極が装着された板状発熱
体において、該板状発熱体が真空加熱成形によつ
て被覆された合成樹脂系絶縁層を有していること
を特徴とする暖房パネル。 2 該合成樹脂系絶縁層は、ガラスクロス、ガラ
スペーパー、セラミツクペーパー等の無機質絶縁
材料を成分とする織布、不織布、混抄紙等の基材
に、エポキシ樹脂、不飽和ポリエステル樹脂、フ
エノール樹脂等の熱硬化性樹脂が、含浸硬化され
、一体化された非孔質材料からなるものである実
用新案登録請求の範囲第1項記載の暖房パネル。[Scope of Claim for Utility Model Registration] 1. A plate-shaped heating element in which an electrode is attached to an inorganic plate-shaped molded body in which a conductive material is dispersed, which generates heat when energized, and the plate-shaped heating element is formed by vacuum thermoforming. A heating panel characterized in that it has a synthetic resin insulating layer coated with a polyurethane resin. 2. The synthetic resin insulating layer is made of epoxy resin, unsaturated polyester resin, phenolic resin, etc. on a base material such as woven fabric, nonwoven fabric, or mixed paper made of inorganic insulating material such as glass cloth, glass paper, or ceramic paper. The heating panel according to claim 1, wherein the heating panel is made of a non-porous material in which the thermosetting resin is impregnated and cured and integrated.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1808089U JPH02109907U (en) | 1989-02-17 | 1989-02-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1808089U JPH02109907U (en) | 1989-02-17 | 1989-02-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02109907U true JPH02109907U (en) | 1990-09-03 |
Family
ID=31232402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1808089U Pending JPH02109907U (en) | 1989-02-17 | 1989-02-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02109907U (en) |
-
1989
- 1989-02-17 JP JP1808089U patent/JPH02109907U/ja active Pending
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