JPH02109278A - Wiring device - Google Patents
Wiring deviceInfo
- Publication number
- JPH02109278A JPH02109278A JP63262640A JP26264088A JPH02109278A JP H02109278 A JPH02109278 A JP H02109278A JP 63262640 A JP63262640 A JP 63262640A JP 26264088 A JP26264088 A JP 26264088A JP H02109278 A JPH02109278 A JP H02109278A
- Authority
- JP
- Japan
- Prior art keywords
- wires
- solder
- plated
- mild steel
- tin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011810 insulating material Substances 0.000 claims abstract description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 46
- 229910001209 Low-carbon steel Inorganic materials 0.000 claims description 44
- 239000007787 solid Substances 0.000 claims description 34
- 238000003780 insertion Methods 0.000 abstract description 19
- 230000037431 insertion Effects 0.000 abstract description 19
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 17
- 229910000679 solder Inorganic materials 0.000 abstract description 16
- 239000011347 resin Substances 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract 5
- 238000005452 bending Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002436 steel type Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、電気機器に使用されるプリント配線基板間
の電気的接続を行う配線装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wiring device for electrically connecting printed wiring boards used in electrical equipment.
近年、ラジオ、ラジオカセ・ントテーブレコーダアマチ
ェア無線機等においては、多機能化が進み、機器内には
複数のプリント配線基板が内蔵されるようになっ°ζき
ている。このため、各プリント配線基板間の電気的接続
を行うために、複数の芯線をもつ配線装置が用いられて
いる。In recent years, radios, radio cassette/table recorders, amateur radios, and the like have become increasingly multi-functional, and a plurality of printed wiring boards have come to be built into the equipment. For this reason, a wiring device having a plurality of core wires is used to electrically connect each printed wiring board.
従来のこの種の配線装置を第５図および第６図に晶づい
て説明する。A conventional wiring device of this type will be explained with reference to FIGS. 5 and 6.
この配線装置５３は、第５図（ａ）、 （ｂ）に示すよ
うに、複数の銅撚線からなる芯線５１が隣接して塩化ビ
ニル等からなる絶縁被膜材５２により絶縁隔離された平
行多芯線からなる。As shown in FIGS. 5(a) and 5(b), this wiring device 53 consists of parallel polygons in which core wires 51 made of a plurality of stranded copper wires are adjacent to each other and insulated and isolated by an insulating coating material 52 made of vinyl chloride or the like. Consists of core wire.
この配線装置５３は、第６図に示すように、プリント配
線基板６０．６１との電気的接続において、まず複数の
芯線５１の一端をプリン］・配線基板６０の外部接続用
端子部５７のそれぞれのＩＪ−ド線挿入孔に挿入し半Ｈ
１５８で接続する。つぎに、複数の芯線５１のそれぞれ
の他端をプリント配線基板６１の外部接続端子部５７′
に半ｌＢ５８で接続されたコネクタ５６のそれぞれの接
続部（図示せず）に挿入し接続している。As shown in FIG. 6, in electrical connection with printed wiring boards 60 and 61, this wiring device 53 first connects one end of a plurality of core wires 51 to each of external connection terminal portions 57 of wiring board 60. Insert it into the IJ-wire insertion hole of
Connect with 158. Next, the other end of each of the plurality of core wires 51 is connected to the external connection terminal portion 57' of the printed wiring board 61.
The connectors 56 are inserted into and connected to respective connecting portions (not shown) of the connectors 56 which are connected by a half-inch B58.
また、この配線装置５３は、芯線５１に銅撚線を用いて
曲げやすい軟らかなものとし、プリント配線基板６０．
６１間の電気的接続を自由に行えるようにり、ている。Moreover, this wiring device 53 uses a copper stranded wire as the core wire 51 and is soft and easy to bend, and the printed wiring board 60.
Electrical connections between the terminals 61 can be made freely.
〔発明が解決しようとする課題］
しかし、この配線装置５３は、複数の芯線５１が隣接し
て設＆Ｊられており、プリント配線基板６０の外部接続
部５７またはプリント配線基板６１の二１ネクタ５６に
挿入、接続するときに、配線装；１ｒｊ５３を一本ずつ
切り離し、それぞれの配線装置５３の端部の絶縁被膜材
５２を除去して導線５１を７．１１き出し、さらに外部
接続端子部５７のり−１・線種入孔やコネクタ５６の接
続部の配置間隔に対応させるためにそれぞれの配線装置
５３の長さを揃えなければならず、作業性が悪く、製造
二Ｉストか高くなるという問題かあ、った。[Problems to be Solved by the Invention] However, in this wiring device 53, a plurality of core wires 51 are installed adjacently, and the external connection portion 57 of the printed wiring board 60 or the second connector 56 of the printed wiring board 61 When inserting and connecting the wiring devices, 1rj53 is cut off one by one, the insulating coating material 52 at the end of each wiring device 53 is removed, the conductor wires 51 are drawn out 7.11, and the external connection terminal portions 57 are removed. The length of each wiring device 53 must be made the same in order to correspond to the placement spacing of the glue-1/wire type holes and the connecting portion of the connector 56, which results in poor workability and high production costs. There was a problem.
また、芯線５１が銅撚線であるため軟らかく、プリント
配線基板６０の外部接続端子部５７のリード線挿入孔や
プリント配線基板６１のコネクタ５６の接続部に挿入す
るときに変形し、作業性が悪くなるという問題があった
。また、従来、芯綿５１のコネクタ５６の接続部への挿
入時の変形を防止するために、第７図に示すように、コ
ネクタ５６にカバー５６ａを設け、芯線５１の挿入時に
、コネクタ５６のコンタクｈ５６ｂ、５６ｃをカバ５６
ａで押し広げるようにし、導線５１の挿入を容易にして
いた。しかし、このようなコネクタ５６では、芯線５１
の変形を防止することはできるが、二１ネクタ５６の構
造が複雑になり、コストが高くなるという問題があった
。In addition, since the core wire 51 is a copper stranded wire, it is soft and deforms when inserted into the lead wire insertion hole of the external connection terminal portion 57 of the printed wiring board 60 or the connection portion of the connector 56 of the printed wiring board 61, reducing workability. The problem was that it was getting worse. Conventionally, in order to prevent deformation of the cotton core 51 when it is inserted into the connecting portion of the connector 56, a cover 56a is provided on the connector 56 as shown in FIG. Contact h56b, 56c cover 56
The conductive wire 51 was made easy to insert by pushing it apart with a. However, in such a connector 56, the core wire 51
Although deformation of the connector 56 can be prevented, there is a problem in that the structure of the connector 56 becomes complicated and the cost increases.
したがって、この発明の目的は、配線作業を簡単にでき
、ニノストの低減を図ることのできる配線装置を提供す
ることである。Therefore, an object of the present invention is to provide a wiring device that can simplify wiring work and reduce ninost.
この発明の配線装置は、複数のスズ半田メッキ軟鋼単線
を一定間隔に平行に並べ、前記複数のスズ半田メッキ軟
鋼中線の長さ方向の複数の位置を絶縁材で固定した構成
としている。The wiring device of the present invention has a configuration in which a plurality of tin solder-plated mild steel solid wires are arranged in parallel at regular intervals, and a plurality of longitudinal positions of the plurality of tin solder-plated mild steel medium wires are fixed with an insulating material.
（作 用〕
この発明の構成によれば、スズ半田メッキ軟鋼単線を用
いたので、先端部の曲げ強度が高く、プリント配線基板
の外部接続端子部のリード線挿入孔またはコネクタに挿
入時にスズ半Ｈ（メッキ軟鋼単線の先端部が変形するご
とがない。そして、複数のスズ半田メッキ軟鋼単線を一
定間隔で平行に並べて絶縁材で固定したので、スズ半田
メッキ軟鋼単線同士を絶縁隔離することができる。また
、絶縁被膜材を使用しないスズ半田メッキ軟鋼単線とし
たので、複数のスズ半田メンキ軟鋼単線の長さ方向に対
する曲げ強度を適正な値にするごとができ、簡単に曲げ
ることができる。したがって、プリント配線基板の外部
接続端子部のり−］線押挿入孔たはコネクタの配置間隔
に対応して複数のスズ半田メッキ軟鋼単線の間隔を設定
しておけば、プリント配線基板のそれぞれのリード線挿
入孔またはコネクタに挿入するために、平行多芯線のよ
うに一本一本のスズ半田メッキ軟鋼単線を切断加工する
必要がなくなり、複数のスズ半田メッキ軟鋼単線を必要
な長さで切断するだけで、プリント配線基板のリード線
挿入孔またはコネクタに簡単に挿入することができる。(Function) According to the configuration of the present invention, since the tin solder-plated solid mild steel wire is used, the bending strength at the tip is high, and when inserted into the lead wire insertion hole of the external connection terminal part of the printed wiring board or the connector, the tin solder plated solid wire is used. H (The tip of the plated mild steel solid wire does not deform. Also, since multiple tin solder plated mild steel solid wires are lined up in parallel at regular intervals and fixed with insulating material, it is possible to insulate and isolate the tin solder plated mild steel solid wires from each other. In addition, since the tin solder plated single wire is made of mild steel without using an insulating coating material, the bending strength in the longitudinal direction of the plurality of tin solder coated single soft steel wires can be set to an appropriate value and can be easily bent. Therefore, if you set the spacing between multiple tin solder-plated mild steel wires in accordance with the wiring insertion holes or the connector placement spacing in the external connection terminal section of the printed wiring board, each lead on the printed wiring board Unlike parallel multicore wires, it is no longer necessary to cut individual tin solder-plated solid mild steel wires to insert them into wire insertion holes or connectors, and multiple tin solder-plated solid mild steel wires can be cut to the required length. It can be easily inserted into the lead wire insertion hole of the printed wiring board or connector.
この発明の配線装置の実施例を第１図に基づいて説明す
る。An embodiment of the wiring device of the present invention will be described based on FIG.
この配線装置Ｉは、第１図に示すように、複数のスズ半
田メンキ軟鋼単線ｌと成形樹脂等からなる絶縁材２とか
らなり、複数のスズ半田メンキ軟鋼単線１を一定間隔で
平行に並べ、複数のスズ半田メッキ軟鋼単線１の長さ！
方向の複数の位置を絶縁材２で固定している。また、複
数のスズ半田メンキ軟鋼単線１の間隔は、接続するプリ
ント配線基板の外部接続端子部のリード線挿入孔（図示
せず）またはコネクタの接続部（図示せず）の配置間隔
に対応して設定されている。絶縁材２は、各々の幅寸法
が一定寸法ａに成形され、一定間隔すで配設されている
。As shown in Fig. 1, this wiring device I consists of a plurality of tin solder-coated solid mild steel wires 1 and an insulating material 2 made of molded resin, etc., and a plurality of tin solder-coated mild steel single wires 1 are arranged in parallel at regular intervals. , multiple lengths of tin solder-plated mild steel solid wire 1!
A plurality of positions in the direction are fixed with insulating material 2. In addition, the spacing between the plurality of tin solder coated soft steel single wires 1 corresponds to the arrangement spacing of the lead wire insertion holes (not shown) of the external connection terminal part of the printed wiring board to be connected or the connection part of the connector (not shown). is set. The insulating materials 2 are each formed to have a constant width a, and are arranged at constant intervals.
この配線装置Ｉの使用例を第２図ないし第４図に示す。Examples of how this wiring device I is used are shown in FIGS. 2 to 4.
第２図に示す使用例は、配線装置ｆｌをプリント配線基
板１０．１１の外部接続端子部３３′のリード線挿入孔
（図示せず）に直接半田７で接続したものである。In the usage example shown in FIG. 2, the wiring device fl is directly connected to a lead wire insertion hole (not shown) of an external connection terminal portion 33' of a printed wiring board 10.11 with solder 7.
第３図に示す使用例は、配線装置■の複数のスズ半１１
１メッキ軟鋼単線】のそれぞれの一端をプリント配線基
板１０の夕（部接続端子部３のリード線挿入孔（図示」
ｌず）に半田７で接続し、複数のスズ半田メッキ軟鋼単
線ｌのそれぞれの他端をプリント配線基板１２に半田７
で接続されたコネクタ６の接続部（図示ゼず）に接続し
たものである。The example of use shown in Fig. 3 is to connect multiple tin halves 11
Connect one end of each of the 1-plated mild steel solid wires to the lead wire insertion holes (shown in the figure) of the connection terminal section 3 of the printed wiring board 10.
solder 7 to the printed wiring board 12, and connect the other end of each of the plural tin solder-plated solid mild steel wires to the printed wiring board 12 with solder 7.
The connector 6 is connected to the connecting portion (not shown) of the connector 6 connected to the connector 6.
第２図および第３図に示す４，５．５’は、それぞれプ
リント配線基板１０．ＩＩ、＋２に装備された電子部品
を示している。4 and 5.5' shown in FIGS. 2 and 3 are printed wiring boards 10. It shows the electronic components installed in II and +2.
スズ半田メッキ軟鋼単線１とコネクタ６との接続は、第
４図（ａ）に示すように、まずスズ半田メッキ軟鋼型ａ
１を矢印Ａの方向からコネクタ６のＪＴ。The connection between the tin solder-plated mild steel solid wire 1 and the connector 6 is first made using the tin solder-plated mild steel type a, as shown in Fig. 4(a).
1 to JT of connector 6 from the direction of arrow A.
方から差し込む。このとき、スズ半田メッキ軟鋼単線ｌ
の先端部は曲げ強度が高いため、スズ半１’Ｊｌメッキ
軟鋼単線ｌが変形せず、第４［Ｊ（ｂ）に示すように、
スズ半田メッキ軟鋼単線１をコネクタ６のコンタクト６
ａ、６ｂの間に簡単に挿入することができる。Insert it from the side. At this time, tin solder-plated mild steel solid wire l
Since the bending strength is high at the tip of the tin half 1'Jl plated solid mild steel wire l, it does not deform, and as shown in the fourth [J(b),
Connect the tin solder-plated mild steel solid wire 1 to the contact 6 of the connector 6.
It can be easily inserted between a and 6b.
この配線装置Ｉは、複数のスズ半田メッキ軟鋼単線１を
一定間隔に平行に並べて絶縁材２で固定したので、スズ
半田メッキ軟鋼単線１同士を絶縁隔離することができる
。また、絶縁被膜材を使用しないスズ半田メッキ軟鋼単
線ｌとしたので、複数のスズ半田メッキ軟鋼単線１の長
さＰ方向の曲げ強度を適正な値にすることができ、接続
装置１を簡単に曲げることができる。したがって、プリ
ント配線基板１０．１１または１０．１２間の配線を自
由に行うことができる。In this wiring device I, a plurality of tin solder-plated solid mild steel wires 1 are arranged in parallel at regular intervals and fixed with an insulating material 2, so that the tin solder-plated solid mild steel wires 1 can be insulated and isolated from each other. In addition, since the tin solder-plated solid mild steel wire 1 is used without using an insulating coating material, the bending strength in the length P direction of the plurality of tin solder-plated solid mild steel wires 1 can be set to an appropriate value, and the connecting device 1 can be easily assembled. Can be bent. Therefore, wiring between printed wiring boards 10.11 or 10.12 can be freely performed.
また、スズ半田メッキ軟鋼単線１を用いたので、先端部
の曲げ強度が高く、プリント配線基板１０１１．１．２
の外部接続端子部３．３′のリード線挿入孔およびコネ
クタ６の接続部にスズ半田メッキ軟鋼単線１を挿入する
ときに、スズ半田メッキ軟鋼単線１の先端部が変形する
ことがなく、簡単に挿入することができる。さらに、複
数のスズ半田メッキ軟鋼単線１の間隔をプリント配線基
板１０゜１１、．１．２の外部接続端子部３．３′のリ
ード線挿入孔またはコネクタ６の接続部の配置間隔に対
応させたので、第５図に示す従来の配線装置５３のよう
に、−本一本の配線装置５３を切断、加工する必要がな
くなり、しかも配線装置Ｉの複数のスズ半田メッキ軟＠
’４１線Ｉを外部接続端子部３゜３′のリード線挿入孔
またはコネクタ６の接続部に、−・度に挿入することが
できる。したがって、複数のスズ半田メンキ軟鋼単線ｌ
をプリント配線基板１０．１１または１０．１２間の接
続に必要な長さに切断し、それぞれの外部接続端子部３
３′のリード線挿入孔またはコネクタ６の接続部に挿入
、接続するだけで配線作業を完了することができる。こ
の結果、配線作業を簡単にすることができ、作業工数を
削減することができる。In addition, since the tin solder-plated mild steel single wire 1 is used, the bending strength at the tip is high, and the printed wiring board 1011.1.2
When inserting the tin solder plated solid mild steel wire 1 into the lead wire insertion hole of the external connection terminal part 3.3' and the connection part of the connector 6, the tip of the tin solder plated solid mild steel wire 1 does not deform, making it easy to insert. can be inserted into. Furthermore, the intervals between the plurality of tin solder-plated mild steel single wires 1 are adjusted to the printed wiring board 10° 11, . Since the spacing corresponds to the arrangement spacing of the lead wire insertion holes of the external connection terminal portion 3.3' of 1.2 or the connection portion of the connector 6, as in the conventional wiring device 53 shown in FIG. It is no longer necessary to cut or process the wiring device 53 of the wiring device I, and moreover, the wiring device I has multiple tin solder soft plating @
The '41 wire I can be inserted into the lead wire insertion hole of the external connection terminal portion 3.degree. 3' or the connection portion of the connector 6 at -.degree. Therefore, multiple tin solder coated mild steel solid wire l
Cut the printed wiring board 10.11 or 10.12 to the length required for connection, and connect each external connection terminal part 3.
The wiring work can be completed by simply inserting and connecting the lead wire into the lead wire insertion hole 3' or the connecting portion of the connector 6. As a result, the wiring work can be simplified and the number of work steps can be reduced.
また、配線装置■の両端部のそれぞれの絶縁（Ａ２がス
トッパーの役割をし、プリント配線基板１０゜１１の外
部接続端子部３．３′のリード線挿入孔へ複数のスズ半
田メッキ軟鋼単線１を挿入したときに、一定長のスズ半
田メッキ軟鋼単線Ｉがリド線挿入孔から突出することに
なり、半田付は作業をより簡単にすることができる。ま
た、プリント配線基板１２のコネクタ６の接続部へ挿入
したときも同様に、絶縁材２から突出する複数のスズ半
田メッキ軟鋼単線１が一定長になり、複数のスズ半田メ
ッキ軟鋼単線ｌとコネクタ６のそれぞれの接続部との接
続状態を安定したものにできる。In addition, each insulator (A2) at both ends of the wiring device (2) acts as a stopper, and a plurality of tin solder-plated mild steel single wires (1) are inserted into the lead wire insertion hole of the external connection terminal section (3, 3') of the printed wiring board (10°, 11). When the connector 6 of the printed wiring board 12 is inserted, a fixed length of tin solder-plated mild steel single wire I will protrude from the lead wire insertion hole, making the soldering work easier. Similarly, when inserted into the connection part, the plurality of tin solder-plated solid mild steel wires 1 protruding from the insulating material 2 have a constant length, and the connection state between the plurality of tin solder-plated solid mild steel wires 1 and each connection part of the connector 6 is established. can be made stable.
なお、この実施例の配線装置におい°ζは、絶縁材２の
幅を一定寸法ａとし、絶縁材２間の間隔を一定寸法すと
したが、絶縁材２０輻寸法ａおよび絶縁材２間の間隔の
寸法すにばらつきがあっても問題はない。In the wiring device of this embodiment, the width of the insulating material 2 is a constant dimension a, and the distance between the insulating materials 2 is a constant dimension. There is no problem even if there are variations in the spacing dimensions.
この発明の配線装置は、スズ半田メッキ軟鋼単線を用い
たので、先端部の曲げ強度を高くすることができる。そ
して、複数のスズ半田メッキ軟鋼単線を一定間隔で平行
に並べて絶縁材により固定した構成としたので、スズ半
ロ］メッキ軟鋼単線の長さ方向の曲げ強度を適正な値に
することができ、しかもスズ半田メッキ軟鋼単線の絶縁
を確保することができる。したがって、複数のスズ半田
メッキ軟鋼単線の間隔をプリント配線基板の外部接続端
子部のリード線挿入孔または：Ｊコネクタ間隔に対応さ
せてスズ半ＩＩメッキ軟鋼単線を配置することにより、
複数のスズ半ロ１メッキ軟鋼単線を必要な長ざに切断す
るだけで、プリント配線基板の外部接続端子部のリード
線挿入孔またはコネククヘのスズ半田メッキ軟鋼単線の
挿入、接続を簡単に行うことができる。この結果、配線
作業を簡単にでき、コストの低減を図ることができる。Since the wiring device of the present invention uses a tin solder-plated mild steel single wire, the bending strength of the tip portion can be increased. Since the structure is such that a plurality of tin solder-plated solid mild steel wires are arranged in parallel at regular intervals and fixed with an insulating material, the bending strength in the longitudinal direction of the tin solder-plated solid mild steel wires can be set to an appropriate value. Moreover, the insulation of the tin solder-plated mild steel single wire can be ensured. Therefore, by arranging the tin semi-II plated solid mild steel wires so that the intervals between the plurality of tin solder-plated solid mild steel wires correspond to the lead wire insertion holes of the external connection terminal portion of the printed wiring board or the spacing of the :J connector,
To easily insert and connect tin solder-plated solid mild steel wires into lead wire insertion holes or connectors of external connection terminals on printed wiring boards by simply cutting multiple tin solder-plated solid mild steel wires into the required length. Can be done. As a result, wiring work can be simplified and costs can be reduced.
第１図はこの発明の実施例の斜視図、第２図は第１図の
配線装置を用いた半田（ζｊけ番こよるプリント配線基
板間の接続図、第３図は第１図の配線装置とコネクタを
用いたプリント配線基板との接続図、第４図（ａ）は第
１図の配線装置のコネクタとの接続前を示す断面図、第
４図（ｂ）は第１図の配線装置とコネクタとの接続を示
す断面図、第５図（ａ）は従来の接続装置の正面図、第
５図（１））は同図（ａ）の側面図、第６図は第５図の
配線装置によるプリント配線基板間の接続図、第７図は
第５し１の配！ＩｆＡ装置とコネクタとの接続を示す断
面図である。
１・・・スズ半田メッキ軟鋼単線、２・・ｔｌ！縁材二
′−ｊ
第
図
Ａｌ 、 ’）工
６ｂ−Ｉべ止二
２、−１０９２７８（５）
（ａ）
（ｂ）FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a connection diagram between printed wiring boards using the wiring device shown in FIG. 1, and FIG. A connection diagram between the device and a printed wiring board using a connector, FIG. 4(a) is a sectional view showing the wiring device of FIG. 1 before connection with the connector, and FIG. 4(b) is a diagram of the wiring of FIG. 1. 5(a) is a front view of the conventional connecting device, FIG. 5(1)) is a side view of FIG. 5(a), and FIG. 6 is a sectional view showing the connection between the device and the connector. The connection diagram between printed wiring boards using the wiring device shown in Fig. 7 is the connection diagram of No. 5 and 1! FIG. 3 is a cross-sectional view showing the connection between the IfA device and the connector. 1...Tin solder-plated mild steel solid wire, 2...tl! Edge material 2'-j Figure Al, ') Work 6b-I Beginner 2, -109278 (5) (a) (b)
Claims (1)
、前記複数のスズ半田メッキ軟鋼単線の長さ方向の複数
の位置を絶縁材で固定した配線装置。A wiring device in which a plurality of tin solder-plated solid mild steel wires are arranged in parallel at regular intervals, and a plurality of longitudinal positions of the plurality of tin solder-plated solid mild steel wires are fixed with an insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63262640A JPH02109278A (en) | 1988-10-17 | 1988-10-17 | Wiring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63262640A JPH02109278A (en) | 1988-10-17 | 1988-10-17 | Wiring device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02109278A true JPH02109278A (en) | 1990-04-20 |
Family
ID=17378593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63262640A Pending JPH02109278A (en) | 1988-10-17 | 1988-10-17 | Wiring device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02109278A (en) |
-
1988
- 1988-10-17 JP JP63262640A patent/JPH02109278A/en active Pending
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