JPH0210918U - - Google Patents
Info
- Publication number
- JPH0210918U JPH0210918U JP8875888U JP8875888U JPH0210918U JP H0210918 U JPH0210918 U JP H0210918U JP 8875888 U JP8875888 U JP 8875888U JP 8875888 U JP8875888 U JP 8875888U JP H0210918 U JPH0210918 U JP H0210918U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- foaming
- low
- pressure gas
- stationary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005187 foaming Methods 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- 239000002994 raw material Substances 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
- B29C45/4005—Ejector constructions; Ejector operating mechanisms
- B29C45/401—Ejector pin constructions or mountings
- B29C2045/4015—Ejector pins provided with sealing means
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8875888U JPH0210918U (US20090163788A1-20090625-C00002.png) | 1988-07-04 | 1988-07-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8875888U JPH0210918U (US20090163788A1-20090625-C00002.png) | 1988-07-04 | 1988-07-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0210918U true JPH0210918U (US20090163788A1-20090625-C00002.png) | 1990-01-24 |
Family
ID=31313318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8875888U Pending JPH0210918U (US20090163788A1-20090625-C00002.png) | 1988-07-04 | 1988-07-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0210918U (US20090163788A1-20090625-C00002.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001129833A (ja) * | 1999-11-05 | 2001-05-15 | Miyagi Oki Electric Co Ltd | 成形金型及び半導体装置の製造方法 |
-
1988
- 1988-07-04 JP JP8875888U patent/JPH0210918U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001129833A (ja) * | 1999-11-05 | 2001-05-15 | Miyagi Oki Electric Co Ltd | 成形金型及び半導体装置の製造方法 |
