JPH02108377U - - Google Patents
Info
- Publication number
- JPH02108377U JPH02108377U JP1618389U JP1618389U JPH02108377U JP H02108377 U JPH02108377 U JP H02108377U JP 1618389 U JP1618389 U JP 1618389U JP 1618389 U JP1618389 U JP 1618389U JP H02108377 U JPH02108377 U JP H02108377U
- Authority
- JP
- Japan
- Prior art keywords
- resin layer
- case
- cylindrical body
- solid
- electronic element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 1
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1618389U JPH02108377U (US20100223739A1-20100909-C00025.png) | 1989-02-14 | 1989-02-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1618389U JPH02108377U (US20100223739A1-20100909-C00025.png) | 1989-02-14 | 1989-02-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02108377U true JPH02108377U (US20100223739A1-20100909-C00025.png) | 1990-08-29 |
Family
ID=31228887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1618389U Pending JPH02108377U (US20100223739A1-20100909-C00025.png) | 1989-02-14 | 1989-02-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02108377U (US20100223739A1-20100909-C00025.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008288381A (ja) * | 2007-05-17 | 2008-11-27 | Auto Network Gijutsu Kenkyusho:Kk | 電子ユニット |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6338052A (ja) * | 1986-08-01 | 1988-02-18 | Nippon Denso Co Ltd | 車両用点灯制御装置 |
| JPS63132461A (ja) * | 1986-11-21 | 1988-06-04 | Mitsubishi Electric Corp | 半導体装置 |
| JPS6418244A (en) * | 1987-06-30 | 1989-01-23 | Gentron Corp | Circuit package with chimney part for relieving thermal expansion |
-
1989
- 1989-02-14 JP JP1618389U patent/JPH02108377U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6338052A (ja) * | 1986-08-01 | 1988-02-18 | Nippon Denso Co Ltd | 車両用点灯制御装置 |
| JPS63132461A (ja) * | 1986-11-21 | 1988-06-04 | Mitsubishi Electric Corp | 半導体装置 |
| JPS6418244A (en) * | 1987-06-30 | 1989-01-23 | Gentron Corp | Circuit package with chimney part for relieving thermal expansion |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008288381A (ja) * | 2007-05-17 | 2008-11-27 | Auto Network Gijutsu Kenkyusho:Kk | 電子ユニット |
