JPH02108362U - - Google Patents
Info
- Publication number
- JPH02108362U JPH02108362U JP1673089U JP1673089U JPH02108362U JP H02108362 U JPH02108362 U JP H02108362U JP 1673089 U JP1673089 U JP 1673089U JP 1673089 U JP1673089 U JP 1673089U JP H02108362 U JPH02108362 U JP H02108362U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- circuit elements
- substrate
- temporary substrate
- smooth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 4
- 239000003990 capacitor Substances 0.000 claims 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1673089U JPH0720939Y2 (ja) | 1989-02-15 | 1989-02-15 | 平滑基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1673089U JPH0720939Y2 (ja) | 1989-02-15 | 1989-02-15 | 平滑基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02108362U true JPH02108362U (sl) | 1990-08-29 |
JPH0720939Y2 JPH0720939Y2 (ja) | 1995-05-15 |
Family
ID=31229912
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1673089U Expired - Lifetime JPH0720939Y2 (ja) | 1989-02-15 | 1989-02-15 | 平滑基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0720939Y2 (sl) |
-
1989
- 1989-02-15 JP JP1673089U patent/JPH0720939Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0720939Y2 (ja) | 1995-05-15 |