JPH02106891U - - Google Patents
Info
- Publication number
- JPH02106891U JPH02106891U JP1617989U JP1617989U JPH02106891U JP H02106891 U JPH02106891 U JP H02106891U JP 1617989 U JP1617989 U JP 1617989U JP 1617989 U JP1617989 U JP 1617989U JP H02106891 U JPH02106891 U JP H02106891U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- electronic element
- circuit board
- elastic locking
- locking pawl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000000078 claw Anatomy 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1617989U JPH02106891U (de) | 1989-02-14 | 1989-02-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1617989U JPH02106891U (de) | 1989-02-14 | 1989-02-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02106891U true JPH02106891U (de) | 1990-08-24 |
Family
ID=31228879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1617989U Pending JPH02106891U (de) | 1989-02-14 | 1989-02-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02106891U (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101020764B1 (ko) * | 2007-06-25 | 2011-03-09 | (주)리더라이텍 | 방수 코팅한 피시비 기판 케이스의 제조방법 |
-
1989
- 1989-02-14 JP JP1617989U patent/JPH02106891U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101020764B1 (ko) * | 2007-06-25 | 2011-03-09 | (주)리더라이텍 | 방수 코팅한 피시비 기판 케이스의 제조방법 |