JPH02106851U - - Google Patents
Info
- Publication number
- JPH02106851U JPH02106851U JP1454789U JP1454789U JPH02106851U JP H02106851 U JPH02106851 U JP H02106851U JP 1454789 U JP1454789 U JP 1454789U JP 1454789 U JP1454789 U JP 1454789U JP H02106851 U JPH02106851 U JP H02106851U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- pin
- resin substrate
- dish
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1454789U JPH02106851U (US20100223739A1-20100909-C00005.png) | 1989-02-08 | 1989-02-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1454789U JPH02106851U (US20100223739A1-20100909-C00005.png) | 1989-02-08 | 1989-02-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02106851U true JPH02106851U (US20100223739A1-20100909-C00005.png) | 1990-08-24 |
Family
ID=31225840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1454789U Pending JPH02106851U (US20100223739A1-20100909-C00005.png) | 1989-02-08 | 1989-02-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02106851U (US20100223739A1-20100909-C00005.png) |
-
1989
- 1989-02-08 JP JP1454789U patent/JPH02106851U/ja active Pending
