JPH02106808U - - Google Patents
Info
- Publication number
- JPH02106808U JPH02106808U JP1364689U JP1364689U JPH02106808U JP H02106808 U JPH02106808 U JP H02106808U JP 1364689 U JP1364689 U JP 1364689U JP 1364689 U JP1364689 U JP 1364689U JP H02106808 U JPH02106808 U JP H02106808U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- surface mount
- coil body
- core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims 2
Landscapes
- Coils Or Transformers For Communication (AREA)
Description
第１図は本考案に係る面実装インダクタンス素
子の実施例を示す一部を断面とした平面図、第２
図は同正面図、第３図は一部を断面とした同側面
図、第４図は実施例で使用するプリント基板の平
面図、第５図は本考案の他の実施例を示す平面図
である。
１……プリント基板、２……面実装用端子、３
，３Ａ……コア、４，５……導体パターン、６…
…コイル本体、８……絶縁被覆線、１１……モー
ルド。
FIG. 1 is a partially sectional plan view showing an embodiment of the surface mount inductance element according to the present invention;
3 is a partially sectional side view of the same, FIG. 4 is a plan view of a printed circuit board used in the embodiment, and FIG. 5 is a plan view showing another embodiment of the present invention. It is. 1...Printed circuit board, 2...Surface mount terminal, 3
, 3A... Core, 4, 5... Conductor pattern, 6...
... Coil body, 8 ... Insulated wire, 11 ... Mold.
Claims (1)
体を配置した面実装インダクタンス素子において
、前記コイル本体の巻線の一部を構成する導体パ
ターンを前記プリント基板上に形成し、前記コイ
ル本体のコアをまたぐ配線と前記導体パターンと
によつて前記コアを巻回する巻線を構成したこと
を特徴とする面実装インダクタンス素子。 In a surface mount inductance element in which a coil body is arranged on a printed circuit board having surface mount terminals, a conductor pattern constituting a part of the winding of the coil body is formed on the printed circuit board, and a core of the coil body is formed on the printed circuit board. A surface mount inductance element characterized in that a winding around the core is formed by the wiring that straddles the wire and the conductor pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1364689U JPH02106808U (en) | 1989-02-09 | 1989-02-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1364689U JPH02106808U (en) | 1989-02-09 | 1989-02-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02106808U true JPH02106808U (en) | 1990-08-24 |
Family
ID=31224131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1364689U Pending JPH02106808U (en) | 1989-02-09 | 1989-02-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02106808U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018500768A (en) * | 2014-12-19 | 2018-01-11 | 日本テキサス・インスツルメンツ株式会社 | Embedded coil assembly and method of making the same |
-
1989
- 1989-02-09 JP JP1364689U patent/JPH02106808U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018500768A (en) * | 2014-12-19 | 2018-01-11 | 日本テキサス・インスツルメンツ株式会社 | Embedded coil assembly and method of making the same |