JPH02106467U - - Google Patents
Info
- Publication number
- JPH02106467U JPH02106467U JP1332389U JP1332389U JPH02106467U JP H02106467 U JPH02106467 U JP H02106467U JP 1332389 U JP1332389 U JP 1332389U JP 1332389 U JP1332389 U JP 1332389U JP H02106467 U JPH02106467 U JP H02106467U
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- supply contact
- contact
- air
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims 3
- 239000007788 liquid Substances 0.000 claims 1
- 239000007921 spray Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
第１図は本考案の一実施例の要部構成説明図、
第２図は第１図のα―α断面図、第３図は本考案
の他の実施例の要部構成説明図、第４図は第３図
のβ―β断面図、第５図は従来より一般に使用さ
れている従来例の構成説明図である。
１１……給電コンタクト本体、１２……露出部
、１３，１４……エヤーガイド、Ａ……被メツキ
物、Ｂ……空気層。
FIG. 1 is an explanatory diagram of the main part configuration of an embodiment of the present invention,
Fig. 2 is an α-α sectional view of Fig. 1, Fig. 3 is an explanatory diagram of the main part configuration of another embodiment of the present invention, Fig. 4 is a β-β sectional view of Fig. 3, and Fig. 5 is a sectional view taken along the β-β line of Fig. 3. FIG. 2 is a configuration explanatory diagram of a conventional example that has been commonly used. DESCRIPTION OF SYMBOLS 11...Power supply contact main body, 12...Exposed part, 13, 14...Air guide, A...Object to be plated, B...Air layer.
Claims (1)
コンタクト本体の被メツキ物との接触部がメツキ
液に接触しないように空気を吹付けて空気層を形
成するエヤーガイドとを具備したことを特徴とす
るメツキ作業用給電コンタクト。[Scope of Claim for Utility Model Registration] In a power supply contact for plating work, air is provided between the power supply contact body and the part of the power supply contact provided surrounding the power supply contact body to prevent the contact part of the power supply contact body with the object to be plated from coming into contact with the plating liquid. A power supply contact for plating work, characterized in that it is equipped with an air guide that sprays water to form an air layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1332389U JPH02106467U (en) | 1989-02-07 | 1989-02-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1332389U JPH02106467U (en) | 1989-02-07 | 1989-02-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02106467U true JPH02106467U (en) | 1990-08-23 |
Family
ID=31223532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1332389U Pending JPH02106467U (en) | 1989-02-07 | 1989-02-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02106467U (en) |
-
1989
- 1989-02-07 JP JP1332389U patent/JPH02106467U/ja active Pending