JPH02105438U - - Google Patents
Info
- Publication number
- JPH02105438U JPH02105438U JP1505589U JP1505589U JPH02105438U JP H02105438 U JPH02105438 U JP H02105438U JP 1505589 U JP1505589 U JP 1505589U JP 1505589 U JP1505589 U JP 1505589U JP H02105438 U JPH02105438 U JP H02105438U
- Authority
- JP
- Japan
- Prior art keywords
- floor
- base material
- board
- electrostatic
- panel base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 3
- 229910052918 calcium silicate Inorganic materials 0.000 claims 1
- 239000000378 calcium silicate Substances 0.000 claims 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 claims 1
- 239000004568 cement Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 239000002023 wood Substances 0.000 claims 1
Description
第１図および第２図は本考案にかかる第１実施
例の断面図および斜視図、第３図は本考案にかか
る第２実施例の断面図、第４図は本考案にかかる
第３実施例の断面図である。
１…床下地、２…支持部材、３…載置部（上端
部）、１０…非帯電性床パネル、１１…パネル基
材、１２，１３…非帯電層、１４…導電性ピン。
1 and 2 are a cross-sectional view and a perspective view of a first embodiment of the present invention, FIG. 3 is a cross-sectional view of a second embodiment of the present invention, and FIG. 4 is a third embodiment of the present invention. FIG. 3 is an example cross-sectional view. DESCRIPTION OF SYMBOLS 1... Floor base, 2... Supporting member, 3... Placement part (upper end part), 10... Non-electrostatic floor panel, 11... Panel base material, 12, 13... Non-electrostatic layer, 14... Conductive pin.
Claims (1)
持部材を、床下地上に所定間隔で設け、パーテイ
クルボード、木片セメント板、ケイ酸カルシウム
板等の非金属製パネル基材の表裏面に非帯電層を
設けるとともに、金属ピン等の導電性部材をパネ
ル基材に貫通させて表裏面の非帯電層を電気的接
続した床パネルを、複数の前記床パネルの裏面側
の非帯電層を前記支持部材の上端部で隣接させて
架け渡して床面を形成したことを特徴とする非帯
電性床構造。 A plurality of supporting members each having at least the upper end formed of a conductive material are provided at predetermined intervals on the subfloor, and a non-electrostatic layer is applied to the front and back surfaces of a non-metallic panel base material such as particle board, wood chip cement board, calcium silicate board, etc. and a floor panel in which the non-charged layers on the front and back sides are electrically connected by passing conductive members such as metal pins through the panel base material, and the non-charged layers on the back side of the plurality of floor panels are connected to the support member. A non-electrostatic floor structure characterized in that the upper ends of the two are adjacent to each other and spanned to form a floor surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1505589U JPH02105438U (en) | 1989-02-10 | 1989-02-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1505589U JPH02105438U (en) | 1989-02-10 | 1989-02-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02105438U true JPH02105438U (en) | 1990-08-22 |
Family
ID=31226775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1505589U Pending JPH02105438U (en) | 1989-02-10 | 1989-02-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02105438U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001214602A (en) * | 2000-02-03 | 2001-08-10 | Lonseal Corp | Conductive floor tile and its laying method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61142248A (en) * | 1984-12-17 | 1986-06-30 | 信越ポリマ−株式会社 | Conductive floor material |
| JPS62164953A (en) * | 1986-01-13 | 1987-07-21 | 大成建設株式会社 | Dustless panel having conductivity |
| JPS6317229B2 (en) * | 1980-03-31 | 1988-04-13 | Fujitsu Ltd |
-
1989
- 1989-02-10 JP JP1505589U patent/JPH02105438U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6317229B2 (en) * | 1980-03-31 | 1988-04-13 | Fujitsu Ltd | |
| JPS61142248A (en) * | 1984-12-17 | 1986-06-30 | 信越ポリマ−株式会社 | Conductive floor material |
| JPS62164953A (en) * | 1986-01-13 | 1987-07-21 | 大成建設株式会社 | Dustless panel having conductivity |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001214602A (en) * | 2000-02-03 | 2001-08-10 | Lonseal Corp | Conductive floor tile and its laying method |
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