JPH02104670U - - Google Patents
Info
- Publication number
- JPH02104670U JPH02104670U JP1185089U JP1185089U JPH02104670U JP H02104670 U JPH02104670 U JP H02104670U JP 1185089 U JP1185089 U JP 1185089U JP 1185089 U JP1185089 U JP 1185089U JP H02104670 U JPH02104670 U JP H02104670U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- electronic component
- individual electronic
- terminal
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1185089U JPH02104670U ( ) | 1989-02-03 | 1989-02-03 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1185089U JPH02104670U ( ) | 1989-02-03 | 1989-02-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02104670U true JPH02104670U ( ) | 1990-08-20 |
Family
ID=31220765
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1185089U Pending JPH02104670U ( ) | 1989-02-03 | 1989-02-03 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02104670U ( ) |
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1989
- 1989-02-03 JP JP1185089U patent/JPH02104670U/ja active Pending