JPH02104658U - - Google Patents

Info

Publication number
JPH02104658U
JPH02104658U JP1989012240U JP1224089U JPH02104658U JP H02104658 U JPH02104658 U JP H02104658U JP 1989012240 U JP1989012240 U JP 1989012240U JP 1224089 U JP1224089 U JP 1224089U JP H02104658 U JPH02104658 U JP H02104658U
Authority
JP
Japan
Prior art keywords
sided
double
chip
semiconductor device
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989012240U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0639466Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989012240U priority Critical patent/JPH0639466Y2/ja
Publication of JPH02104658U publication Critical patent/JPH02104658U/ja
Application granted granted Critical
Publication of JPH0639466Y2 publication Critical patent/JPH0639466Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1989012240U 1989-02-06 1989-02-06 表面実装型半導体装置 Expired - Fee Related JPH0639466Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989012240U JPH0639466Y2 (ja) 1989-02-06 1989-02-06 表面実装型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989012240U JPH0639466Y2 (ja) 1989-02-06 1989-02-06 表面実装型半導体装置

Publications (2)

Publication Number Publication Date
JPH02104658U true JPH02104658U (US20030204162A1-20031030-M00001.png) 1990-08-20
JPH0639466Y2 JPH0639466Y2 (ja) 1994-10-12

Family

ID=31221513

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989012240U Expired - Fee Related JPH0639466Y2 (ja) 1989-02-06 1989-02-06 表面実装型半導体装置

Country Status (1)

Country Link
JP (1) JPH0639466Y2 (US20030204162A1-20031030-M00001.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011138880A (ja) * 2009-12-28 2011-07-14 Canon Inc 回路基板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56135984A (en) * 1980-03-27 1981-10-23 Matsushita Electric Ind Co Ltd Manufacture of leadless light emitting diode chip
JPS58194383A (ja) * 1982-05-07 1983-11-12 Sumitomo Electric Ind Ltd 連続組立発光ダイオ−ド

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56135984A (en) * 1980-03-27 1981-10-23 Matsushita Electric Ind Co Ltd Manufacture of leadless light emitting diode chip
JPS58194383A (ja) * 1982-05-07 1983-11-12 Sumitomo Electric Ind Ltd 連続組立発光ダイオ−ド

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011138880A (ja) * 2009-12-28 2011-07-14 Canon Inc 回路基板

Also Published As

Publication number Publication date
JPH0639466Y2 (ja) 1994-10-12

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees