JPH02104636U - - Google Patents
Info
- Publication number
- JPH02104636U JPH02104636U JP1376789U JP1376789U JPH02104636U JP H02104636 U JPH02104636 U JP H02104636U JP 1376789 U JP1376789 U JP 1376789U JP 1376789 U JP1376789 U JP 1376789U JP H02104636 U JPH02104636 U JP H02104636U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin sealing
- lead
- showing
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 3
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1376789U JPH02104636U (fr) | 1989-02-08 | 1989-02-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1376789U JPH02104636U (fr) | 1989-02-08 | 1989-02-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02104636U true JPH02104636U (fr) | 1990-08-20 |
Family
ID=31224361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1376789U Pending JPH02104636U (fr) | 1989-02-08 | 1989-02-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02104636U (fr) |
-
1989
- 1989-02-08 JP JP1376789U patent/JPH02104636U/ja active Pending