JPH02104634U - - Google Patents
Info
- Publication number
- JPH02104634U JPH02104634U JP1283089U JP1283089U JPH02104634U JP H02104634 U JPH02104634 U JP H02104634U JP 1283089 U JP1283089 U JP 1283089U JP 1283089 U JP1283089 U JP 1283089U JP H02104634 U JPH02104634 U JP H02104634U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- wafer holding
- plating
- fixing jig
- bump plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrolytic Production Of Metals (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1283089U JPH02104634U (enExample) | 1989-02-06 | 1989-02-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1283089U JPH02104634U (enExample) | 1989-02-06 | 1989-02-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02104634U true JPH02104634U (enExample) | 1990-08-20 |
Family
ID=31222623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1283089U Pending JPH02104634U (enExample) | 1989-02-06 | 1989-02-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02104634U (enExample) |
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1989
- 1989-02-06 JP JP1283089U patent/JPH02104634U/ja active Pending