JPH02104577U - - Google Patents
Info
- Publication number
- JPH02104577U JPH02104577U JP1217089U JP1217089U JPH02104577U JP H02104577 U JPH02104577 U JP H02104577U JP 1217089 U JP1217089 U JP 1217089U JP 1217089 U JP1217089 U JP 1217089U JP H02104577 U JPH02104577 U JP H02104577U
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- view
- recess
- adhesive layer
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 7
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1217089U JPH02104577U (enExample) | 1989-02-06 | 1989-02-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1217089U JPH02104577U (enExample) | 1989-02-06 | 1989-02-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02104577U true JPH02104577U (enExample) | 1990-08-20 |
Family
ID=31221376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1217089U Pending JPH02104577U (enExample) | 1989-02-06 | 1989-02-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02104577U (enExample) |
-
1989
- 1989-02-06 JP JP1217089U patent/JPH02104577U/ja active Pending