JPH02103828A - Contact for vacuum switch - Google Patents
Contact for vacuum switchInfo
- Publication number
- JPH02103828A JPH02103828A JP25544888A JP25544888A JPH02103828A JP H02103828 A JPH02103828 A JP H02103828A JP 25544888 A JP25544888 A JP 25544888A JP 25544888 A JP25544888 A JP 25544888A JP H02103828 A JPH02103828 A JP H02103828A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- barrier layer
- alloy
- current
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 15
- 229910052709 silver Inorganic materials 0.000 claims abstract description 11
- 238000005219 brazing Methods 0.000 claims description 12
- 150000001247 metal acetylides Chemical class 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 abstract description 17
- 239000000956 alloy Substances 0.000 abstract description 17
- 230000004888 barrier function Effects 0.000 abstract description 14
- 229910052802 copper Inorganic materials 0.000 abstract description 8
- 229910017944 Ag—Cu Inorganic materials 0.000 abstract description 6
- 229910000679 solder Inorganic materials 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- 239000002184 metal Substances 0.000 abstract description 5
- 238000007747 plating Methods 0.000 abstract description 2
- 238000004544 sputter deposition Methods 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 abstract 2
- 238000004079 fireproofing Methods 0.000 abstract 1
- 238000007733 ion plating Methods 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 239000010949 copper Substances 0.000 description 11
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 229910001080 W alloy Inorganic materials 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- UYKQQBUWKSHMIM-UHFFFAOYSA-N silver tungsten Chemical compound [Ag][W][W] UYKQQBUWKSHMIM-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 210000004072 lung Anatomy 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
この発明は、真空開閉器において電流を開閉するために
用いられる真空開閉器用接触子に関する。TECHNICAL FIELD This invention relates to a contact for a vacuum switch used for switching on and off current in a vacuum switch.
高導電性成分のＡｇ （銀）と、耐火性成分のＷＣ（
炭化タングステン）やＷ（タングステン）とからなるＡ
ｇ−ＷＣ，（銀−炭化タングステン）合金やＡｇ −Ｗ
（銀−タングステン）合金は、耐磨耗性が良く、また
さい断電流が小さいことから、真空開閉器の接点材とし
て広く使われている。
これらＡｇ −ＷＣ合金やＡｇ−Ｗ合金を真空開閉器の
接触子として用いるためには、これらの合金からなる接
点部にＣｕ （銅）を主成分とする通電部を接合しな
ければならない。
第４図はそのようにして構成された接触子を示すもので
ある。すなわち、第４図において、■は円板状の接点部
、２は接点部１に接合された丸棒状の通電部である。接
点部１と通電部２との接合は、一般に真空又は水素雰囲
気で銀ろう付けすることによって行われている。Highly conductive component Ag (silver) and fire-resistant component WC (
A consisting of tungsten carbide) and W (tungsten)
g-WC, (silver-tungsten carbide) alloy and Ag-W
(Silver-tungsten) alloy is widely used as a contact material for vacuum switches because of its good wear resistance and low breaking current. In order to use these Ag-WC alloys and Ag-W alloys as contacts of vacuum switches, it is necessary to join a current-carrying part whose main component is Cu (copper) to the contact part made of these alloys. FIG. 4 shows a contact constructed in this manner. That is, in FIG. 4, ▪ is a disk-shaped contact part, and 2 is a round bar-shaped current-carrying part joined to the contact part 1. The contact portion 1 and the current-carrying portion 2 are generally joined by silver brazing in a vacuum or hydrogen atmosphere.
ところで、Ａｇ −ＷＣ合金やＡｇ −Ｗ合金のような
Ａｇを含む材料からなる接点部ｌとＣｕを主成分とする
材料からなる通電部２とが接触すると、ＡｇとＣｕとが
反応してＡｇ−Ｃｕ合金を形成する。このＡｇ−Ｃｕ合
金は銀ろうの役目をするので、接点部１と通電部２とは
ろう材を用いずに接合する、いわゆる拡散接合が可能と
なる反面、接点部ｌからのＡｇと通電部２からのＣｕと
が次から次へと反応すると、接点部１と通電部２との接
合に必要な量販上のＡｇ−Ｃｕ合金が形成され、余剰な
Ａｇ−Ｃｕ合金が接点部１の電気的接触面に染み上がっ
てＡｇ−Ｃｕ合金層を形成する。そうなると、Ａｇ −
ＷＣ合金やＡｇ −Ｗの合金が本来持っている特性が消
失してしまう。
したがって、このような事態を招かないためには、ろう
材以外に、加熱温度や時間などのろう付け条件を厳密に
管理しなければならない。しかしながら、このろう付け
作業は真空炉や水素炉の中で行われるので、ろう付け条
件を厳密に管理するには非常な技術を要する。
そこで、この発明は、接点部と通電部との接合に際して
、接点部の電気的接触面に銀ろう成分が染み上がらない
ようにした真空開閉器用接触子を提供することを目的と
するものである。By the way, when the contact part 1 made of a material containing Ag such as Ag-WC alloy or Ag-W alloy comes into contact with the current-carrying part 2 made of a material mainly composed of Cu, Ag and Cu react and the Ag - Forming a Cu alloy. Since this Ag-Cu alloy acts as a silver solder, contact part 1 and current-carrying part 2 can be joined without using a brazing material, so-called diffusion bonding, but on the other hand, Ag from contact part 1 and current-carrying part When the Cu from 2 reacts one after another, a commercially available Ag-Cu alloy necessary for joining the contact part 1 and the current-carrying part 2 is formed, and the excess Ag-Cu alloy reacts with the electricity of the contact part 1. It soaks up onto the contact surface to form an Ag-Cu alloy layer. In that case, Ag −
The original properties of the WC alloy and Ag-W alloy will disappear. Therefore, in order to prevent such a situation from occurring, brazing conditions such as heating temperature and time must be strictly controlled in addition to the brazing material. However, since this brazing work is performed in a vacuum furnace or hydrogen furnace, it requires a great deal of skill to strictly control the brazing conditions. SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a contactor for a vacuum switch that prevents silver solder components from seeping onto the electrical contact surface of the contact part when joining the contact part and the current-carrying part. .
上記目的を達成するために、この発明は、ＡｇとＷ、Ｍ
ｏ 、Ｃｒ及びこれらの炭化物から選ばれた少なくとも
一種の成分とを含む材料からなる接点部と、Ｃｕを主成
分とする材料からなる通電部とを限ろう付けによって接
合して構成する真空開閉器用接触子において、接点部若
しくは通電部のいずれか一方又は接点部及び通電部の双
方のろう付け面に、Ａｇ及びＣｕとの反応の遅い金属か
らなるバリヤ層を設けるものである。In order to achieve the above object, the present invention provides Ag, W, M
For vacuum switches, the contact part is made of a material containing at least one component selected from O, Cr, and these carbides, and the current-carrying part is made of a material whose main component is Cu, which are joined by limited brazing. In the contactor, a barrier layer made of a metal that reacts slowly with Ag and Cu is provided on either the contact portion or the current-carrying portion, or on the brazing surfaces of both the contact portion and the current-carrying portion.
高導電性成分としてのＡｇと耐火性成分としてのＷ、Ｍ
ｏ 、Ｃｒ及びこれらの炭化物から選ばれた少なくとも
一種の成分とを含む材料からなる接点部と、Ｃｕを主成
分とする材料からなる通電部との間にＡｇ及びＣｕとの
反応速度の遅い金属からなるバリヤ層を設けることによ
り、接点部と通電部との直接接触が阻止され、接点部と
通電部との反応により生じる銀ろう成分が接点部の電気
的接触面に染み上がることがなくなる。Ag as a highly conductive component and W and M as refractory components
o A metal that has a slow reaction rate with Ag and Cu is used between the contact part made of a material containing at least one component selected from o, Cr, and their carbides, and the current carrying part made of a material whose main component is Cu. By providing a barrier layer consisting of the above, direct contact between the contact part and the current-carrying part is prevented, and the silver solder component generated by the reaction between the contact part and the current-carrying part is prevented from seeping into the electrical contact surface of the contact part.
第１図はこの発明の実施例を示すものである。
第１図において、Ａｇ −ＷＣ合金からなる円板状の接
点部ｌのろう付け面にはバルヤ層３が形成されている。
そして、この接点部１は、Ｃｕを主成分とする丸棒状の
通電部２に銀ろう４によりろう付けされている。
実施例の接点部１は次のようにして製作したものである
。まず、ＷＣ粉とＡｇ粉とを混合した後、３０〜５０ｋ
ｇｆ／ｍｍ２圧力で加圧して成形体を得た。次に、この
成形体を９００〜９５０°Ｃの水素雰囲気中で加熱して
焼結体を得た。更に、この焼結体に１０５０°Ｃの水素
雰囲気中でＡｇを溶浸させ、Ａｇ −ＷＣ合金を得た。
このＡｇ−ＷＣ合金から、直径が２５肺、厚さが４ｍｍ
の円板状の接点部１を形成し、そのろう付け面にＮｉめ
っきを施してバリヤ層３を形成した。
実施例のバリヤ層３はめっきによって形成したが、イオ
ンブレーティングやスパッタリングなどの方法でも形成
可能である。また、バリヤ層の材料としては、Ｎｉ以外
にもＡｕ（金）など、Ａｇ及びＣｕとの反応の遅い金属
であれば使用できる。
接点部１と通電部２との接合は、接点部１と通電部２と
の間に直径が２０ｍｍ、厚さが０．１ｎｉｎの銀ろう（
Ａｇ Ｃｕ合金）を挿入し、これらを８００〜８３０
’Ｃの真空中又水素雰囲気中で加熱して行った。
このようにして構成された接触子と従来方法による接触
子とを真空パルプ内に組み立て、真空バルブの電流さい
断値を測定した。その結果を第１表に示す。
第１表
し、その平均値及び最小値〜最大値を求めたものる。異
常値とは３Ａ以上の値をいう。
上記結果からかな通り、実施例のものは従来のものに比
べて電流さい断値が半分以下になり、また異常発生は皆
無になっている。
第３図及び第４図は、それぞれ別の実施例を示すもので
ある。すなわち、第３図は通電部材２にバリヤ層３を設
けたものであり、第４図は接点部材１と通電部材２の双
方にバリヤ層３を設けたものである。このように、接点
部又通電部のいずれか一方にバリヤ層を設けたものでも
、その双方にバリヤ層を設けたものでも、この発明の目
的を達成することができる。
なお、実施例では接点部の材料としてＡｇ −ＷＣ合金
を用いた例を示したが、ＡｇとＷ、Ｍｏ。
Ｃ「及びこれらの炭化物から選ばれた少なくとも一種の
成分とを含む材料からなる接点部についても同様の効果
が得られる。FIG. 1 shows an embodiment of the invention. In FIG. 1, a barrier layer 3 is formed on the brazing surface of a disk-shaped contact portion l made of an Ag-WC alloy. The contact portion 1 is brazed to a round bar-shaped current-carrying portion 2 whose main component is Cu with a silver solder 4. The contact portion 1 of the example was manufactured as follows. First, after mixing WC powder and Ag powder, 30~50k
A molded body was obtained by pressing at a gf/mm2 pressure. Next, this molded body was heated in a hydrogen atmosphere at 900 to 950°C to obtain a sintered body. Further, this sintered body was infiltrated with Ag in a hydrogen atmosphere at 1050°C to obtain an Ag-WC alloy. From this Ag-WC alloy, the diameter is 25 lungs and the thickness is 4 mm.
A disc-shaped contact portion 1 was formed, and the brazing surface thereof was plated with Ni to form a barrier layer 3. Although the barrier layer 3 in the example was formed by plating, it can also be formed by methods such as ion blasting and sputtering. Further, as the material for the barrier layer, other than Ni, any metal that reacts slowly with Ag and Cu, such as Au (gold), can be used. The contact part 1 and the current carrying part 2 are joined by using silver solder (with a diameter of 20 mm and a thickness of 0.1 nin) between the contact part 1 and the current carrying part 2.
Ag Cu alloy) and these are 800~830
The reaction was carried out by heating in a vacuum at 100 °C or in a hydrogen atmosphere. The thus constructed contact and the conventional contact were assembled in a vacuum pulp, and the current cutoff value of the vacuum valve was measured. The results are shown in Table 1. The first table has its average value and minimum to maximum values. An abnormal value is a value of 3A or more. As can be seen from the above results, the current cut-off value of the example is less than half that of the conventional example, and there are no abnormalities. FIGS. 3 and 4 show different embodiments, respectively. That is, FIG. 3 shows a case in which the barrier layer 3 is provided on the current-carrying member 2, and FIG. 4 shows a case in which the barrier layer 3 is provided on both the contact member 1 and the current-carrying member 2. In this way, the object of the present invention can be achieved regardless of whether the barrier layer is provided on either the contact portion or the current-carrying portion, or both of them. In addition, in the example, an example was shown in which Ag-WC alloy was used as the material of the contact part, but Ag, W, and Mo were used. A similar effect can be obtained with a contact portion made of a material containing C and at least one component selected from these carbides.
この発明によれば、ろう付け時に接点部と通電部との反
応によるＡｇ−Ｃｕ合金が接点部の電気的接触面に染み
上がることがなくなり、電気的性能の良好な真空開閉器
用接触子を容易に得ることができる。According to this invention, the Ag-Cu alloy due to the reaction between the contact part and the current-carrying part does not seep into the electrical contact surface of the contact part during brazing, making it easy to produce a vacuum switch contact with good electrical performance. can be obtained.
第１図はこの発明の実施例の側面図、第２図及び第３図
はそれぞれこの発明の異なる実施例の側面図、第４図は
従来例の側面図である。
１・・・接点部、２・・・通電部、３・・・バリヤ層、
４・・・第
図
第
図FIG. 1 is a side view of an embodiment of the invention, FIGS. 2 and 3 are side views of different embodiments of the invention, and FIG. 4 is a side view of a conventional example. DESCRIPTION OF SYMBOLS 1... Contact part, 2... Current carrying part, 3... Barrier layer,
4...Figure Figure
Claims (1)
れた少なくとも一種の成分とを含む材料からなる接点部
と、Ｃｕを主成分とする材料からなる通電部とを銀ろう
付けによって接合して構成する真空開閉器用接触子にお
いて、接点部若しくは通電部のいずれか一方又は接点部
及び通電部の双方のろう付け面に、Ａｇ及びＣｕとの反
応の遅い金属からなるバリヤ層を設けたことを特徴とす
る真空開閉器用接触子。1) A contact part made of a material containing Ag and at least one component selected from W, Mo, Cr, and their carbides, and a current-carrying part made of a material whose main component is Cu are joined by silver brazing. In a vacuum switch contactor constructed of A contact for a vacuum switch characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25544888A JPH02103828A (en) | 1988-10-11 | 1988-10-11 | Contact for vacuum switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25544888A JPH02103828A (en) | 1988-10-11 | 1988-10-11 | Contact for vacuum switch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02103828A true JPH02103828A (en) | 1990-04-16 |
Family
ID=17278911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25544888A Pending JPH02103828A (en) | 1988-10-11 | 1988-10-11 | Contact for vacuum switch |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02103828A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100485242B1 (en) * | 2002-10-21 | 2005-04-25 | 희성금속 주식회사 | Method of forming an electric contact for a vehicle horn |
| JP2019185917A (en) * | 2018-04-04 | 2019-10-24 | 株式会社東芝 | Current-carrying component for vacuum valve, vacuum valve, and method for manufacturing current-carrying component for vacuum valve |
-
1988
- 1988-10-11 JP JP25544888A patent/JPH02103828A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100485242B1 (en) * | 2002-10-21 | 2005-04-25 | 희성금속 주식회사 | Method of forming an electric contact for a vehicle horn |
| JP2019185917A (en) * | 2018-04-04 | 2019-10-24 | 株式会社東芝 | Current-carrying component for vacuum valve, vacuum valve, and method for manufacturing current-carrying component for vacuum valve |
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