JPH02102761U - - Google Patents
Info
- Publication number
- JPH02102761U JPH02102761U JP1093189U JP1093189U JPH02102761U JP H02102761 U JPH02102761 U JP H02102761U JP 1093189 U JP1093189 U JP 1093189U JP 1093189 U JP1093189 U JP 1093189U JP H02102761 U JPH02102761 U JP H02102761U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- conductive layers
- insulating base
- copper
- measurement rounds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000005259 measurement Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 3
- 239000002344 surface layer Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1093189U JPH02102761U (US06373033-20020416-M00071.png) | 1989-01-31 | 1989-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1093189U JPH02102761U (US06373033-20020416-M00071.png) | 1989-01-31 | 1989-01-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02102761U true JPH02102761U (US06373033-20020416-M00071.png) | 1990-08-15 |
Family
ID=31219031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1093189U Pending JPH02102761U (US06373033-20020416-M00071.png) | 1989-01-31 | 1989-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02102761U (US06373033-20020416-M00071.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02146864U (US06373033-20020416-M00071.png) * | 1989-05-12 | 1990-12-13 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6388714A (ja) * | 1986-10-02 | 1988-04-19 | 信越ポリマ−株式会社 | 印刷配線板 |
| JPS63296260A (ja) * | 1987-05-27 | 1988-12-02 | Nec Corp | 混成集積回路の印刷基板 |
-
1989
- 1989-01-31 JP JP1093189U patent/JPH02102761U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6388714A (ja) * | 1986-10-02 | 1988-04-19 | 信越ポリマ−株式会社 | 印刷配線板 |
| JPS63296260A (ja) * | 1987-05-27 | 1988-12-02 | Nec Corp | 混成集積回路の印刷基板 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02146864U (US06373033-20020416-M00071.png) * | 1989-05-12 | 1990-12-13 |
