JPH02102736U - - Google Patents
Info
- Publication number
- JPH02102736U JPH02102736U JP1074489U JP1074489U JPH02102736U JP H02102736 U JPH02102736 U JP H02102736U JP 1074489 U JP1074489 U JP 1074489U JP 1074489 U JP1074489 U JP 1074489U JP H02102736 U JPH02102736 U JP H02102736U
- Authority
- JP
- Japan
- Prior art keywords
- sensitive adhesive
- water
- adhesive layer
- semiconductor wafer
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims description 5
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
第１図、第２図、第３図は本考案の固定部材の
構成例を示した断面図、第４図は湿度による表面
固有抵抗の変化を示したグラフ、第５図は帯電荷
減衰特性を示したグラフである。
１：耐水性シート、１１：支持シート、１２：
蒸着薄層、１３：フイルム、２：感圧接着層、３
：セパレータ。
Figures 1, 2, and 3 are cross-sectional views showing examples of the structure of the fixing member of the present invention, Figure 4 is a graph showing changes in surface resistivity due to humidity, and Figure 5 is charge decay characteristics. This is a graph showing. 1: Water-resistant sheet, 11: Support sheet, 12:
Vapor deposited thin layer, 13: Film, 2: Pressure sensitive adhesive layer, 3
: Separator.
Claims (1)
導体ウエハを接着固定する感圧接着層と、この感
圧接着層を支持する耐水性シートからなり、その
耐水性シートが導電性物質からなる蒸着薄層を有
することを特徴とする半導体ウエハの固定部材。 It consists of a pressure-sensitive adhesive layer that adheres and fixes the semiconductor wafer when it is cut into small element pieces, and a water-resistant sheet that supports this pressure-sensitive adhesive layer, and the water-resistant sheet is a vapor-deposited thin layer made of a conductive material. A semiconductor wafer fixing member comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1074489U JPH02102736U (en) | 1989-01-31 | 1989-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1074489U JPH02102736U (en) | 1989-01-31 | 1989-01-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02102736U true JPH02102736U (en) | 1990-08-15 |
Family
ID=31218675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1074489U Pending JPH02102736U (en) | 1989-01-31 | 1989-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02102736U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0376138A (en) * | 1989-08-18 | 1991-04-02 | Tadahiro Omi | Member contacting with electrified body |
-
1989
- 1989-01-31 JP JP1074489U patent/JPH02102736U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0376138A (en) * | 1989-08-18 | 1991-04-02 | Tadahiro Omi | Member contacting with electrified body |