JPH02102734U - - Google Patents
Info
- Publication number
- JPH02102734U JPH02102734U JP1989011034U JP1103489U JPH02102734U JP H02102734 U JPH02102734 U JP H02102734U JP 1989011034 U JP1989011034 U JP 1989011034U JP 1103489 U JP1103489 U JP 1103489U JP H02102734 U JPH02102734 U JP H02102734U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealed
- semiconductor chip
- leads
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/884—
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- H10W74/00—
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- H10W90/726—
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- H10W90/736—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989011034U JPH02102734U (index.php) | 1989-02-01 | 1989-02-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989011034U JPH02102734U (index.php) | 1989-02-01 | 1989-02-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02102734U true JPH02102734U (index.php) | 1990-08-15 |
Family
ID=31219230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989011034U Pending JPH02102734U (index.php) | 1989-02-01 | 1989-02-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02102734U (index.php) |
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1989
- 1989-02-01 JP JP1989011034U patent/JPH02102734U/ja active Pending