JPH02102727U - - Google Patents
Info
- Publication number
- JPH02102727U JPH02102727U JP1090189U JP1090189U JPH02102727U JP H02102727 U JPH02102727 U JP H02102727U JP 1090189 U JP1090189 U JP 1090189U JP 1090189 U JP1090189 U JP 1090189U JP H02102727 U JPH02102727 U JP H02102727U
- Authority
- JP
- Japan
- Prior art keywords
- oxide film
- wiring layer
- metal wiring
- semiconductor device
- impurities
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 2
- 239000012535 impurity Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Weting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1090189U JPH02102727U (fr) | 1989-01-31 | 1989-01-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1090189U JPH02102727U (fr) | 1989-01-31 | 1989-01-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02102727U true JPH02102727U (fr) | 1990-08-15 |
Family
ID=31218973
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1090189U Pending JPH02102727U (fr) | 1989-01-31 | 1989-01-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02102727U (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015070100A (ja) * | 2013-09-27 | 2015-04-13 | 富士電機株式会社 | 炭化珪素半導体装置の製造方法 |
-
1989
- 1989-01-31 JP JP1090189U patent/JPH02102727U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015070100A (ja) * | 2013-09-27 | 2015-04-13 | 富士電機株式会社 | 炭化珪素半導体装置の製造方法 |