JPH02101596U - - Google Patents
Info
- Publication number
- JPH02101596U JPH02101596U JP974189U JP974189U JPH02101596U JP H02101596 U JPH02101596 U JP H02101596U JP 974189 U JP974189 U JP 974189U JP 974189 U JP974189 U JP 974189U JP H02101596 U JPH02101596 U JP H02101596U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- heat sink
- lead
- relay
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP974189U JPH02101596U (tr) | 1989-01-30 | 1989-01-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP974189U JPH02101596U (tr) | 1989-01-30 | 1989-01-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02101596U true JPH02101596U (tr) | 1990-08-13 |
Family
ID=31216754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP974189U Pending JPH02101596U (tr) | 1989-01-30 | 1989-01-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02101596U (tr) |
-
1989
- 1989-01-30 JP JP974189U patent/JPH02101596U/ja active Pending