JPH02101546U - - Google Patents
Info
- Publication number
- JPH02101546U JPH02101546U JP850889U JP850889U JPH02101546U JP H02101546 U JPH02101546 U JP H02101546U JP 850889 U JP850889 U JP 850889U JP 850889 U JP850889 U JP 850889U JP H02101546 U JPH02101546 U JP H02101546U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- lsi
- mounting structure
- reinforcing frame
- hardening resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 4
- 239000000463 material Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP850889U JPH02101546U (lv) | 1989-01-27 | 1989-01-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP850889U JPH02101546U (lv) | 1989-01-27 | 1989-01-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02101546U true JPH02101546U (lv) | 1990-08-13 |
Family
ID=31214446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP850889U Pending JPH02101546U (lv) | 1989-01-27 | 1989-01-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02101546U (lv) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08213516A (ja) * | 1995-01-31 | 1996-08-20 | Nec Corp | 半導体装置及びその製造方法 |
| JP2014236113A (ja) * | 2013-06-03 | 2014-12-15 | 株式会社デンソー | モールドパッケージ |
-
1989
- 1989-01-27 JP JP850889U patent/JPH02101546U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08213516A (ja) * | 1995-01-31 | 1996-08-20 | Nec Corp | 半導体装置及びその製造方法 |
| JP2014236113A (ja) * | 2013-06-03 | 2014-12-15 | 株式会社デンソー | モールドパッケージ |
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