JPH02101543U - - Google Patents

Info

Publication number

JPH02101543U

JPH02101543U JP849289U JP849289U JPH02101543U JP H02101543 U JPH02101543 U JP H02101543U JP 849289 U JP849289 U JP 849289U JP 849289 U JP849289 U JP 849289U JP H02101543 U JPH02101543 U JP H02101543U

Authority

JP

Japan

Prior art keywords

substrate

conductor plate

pattern

package

grounding

Prior art date

1989-01-27

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 7
• 239000004020 conductor Substances 0.000 claims description 5
• 239000002184 metal Substances 0.000 claims description 3
• 239000000758 substrate Substances 0.000 claims 3
• 238000007789 sealing Methods 0.000 claims 1
• 238000001465 metallisation Methods 0.000 description 1