JPH02101542U - - Google Patents

Info

Publication number
JPH02101542U
JPH02101542U JP953889U JP953889U JPH02101542U JP H02101542 U JPH02101542 U JP H02101542U JP 953889 U JP953889 U JP 953889U JP 953889 U JP953889 U JP 953889U JP H02101542 U JPH02101542 U JP H02101542U
Authority
JP
Japan
Prior art keywords
side wall
resin container
semiconductor device
container side
top lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP953889U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP953889U priority Critical patent/JPH02101542U/ja
Publication of JPH02101542U publication Critical patent/JPH02101542U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａ，ｂは本考案の一実施例の半導体装置
の２個所での断面図、第２図は従来の半導体装置
の容器上部の断面図、第３図は内そりの生じた容
器側壁の平面図、第４図は側壁の内そりが生じた
場合のはめ込みの際生ずる問題点を示す断面図で
ある。 １……容器側壁、２……くぼみ、３……容器上
蓋、４……突出部、５……爪、６……面取り部。 Figures 1a and b are cross-sectional views at two points of a semiconductor device according to an embodiment of the present invention, Figure 2 is a cross-sectional view of the upper part of a container of a conventional semiconductor device, and Figure 3 is a side wall of the container with internal warpage. FIG. 4 is a plan view and a sectional view showing a problem that occurs when fitting the side wall inward when the side wall warps inward. DESCRIPTION OF SYMBOLS 1... Container side wall, 2... Recess, 3... Container top lid, 4... Protrusion, 5... Claw, 6... Chamfer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 樹脂製容器側壁の上部内面に樹脂製容器上蓋の
突出部外面が嵌合するものにおいて、容器側壁の
上縁内側に面取り部が形成されたことを特徴とす
る半導体装置。 1. A semiconductor device in which an outer surface of a protruding portion of a resin container top lid fits into an upper inner surface of a resin container side wall, characterized in that a chamfered portion is formed on an inner side of an upper edge of the container side wall.
JP953889U 1989-01-30 1989-01-30 Pending JPH02101542U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP953889U JPH02101542U (en) 1989-01-30 1989-01-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP953889U JPH02101542U (en) 1989-01-30 1989-01-30

Publications (1)

Publication Number Publication Date
JPH02101542U true JPH02101542U (en) 1990-08-13

Family

ID=31216365

Family Applications (1)

Application Number Title Priority Date Filing Date
JP953889U Pending JPH02101542U (en) 1989-01-30 1989-01-30

Country Status (1)

Country Link
JP (1) JPH02101542U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5841352B2 (en) * 1979-12-29 1983-09-12 日本パ−カライジング株式会社 Coating treatment liquid for metal surfaces
JPS6030542B2 (en) * 1982-06-21 1985-07-17 バンドー化学株式会社 Manufacturing method of toothed belt

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5841352B2 (en) * 1979-12-29 1983-09-12 日本パ−カライジング株式会社 Coating treatment liquid for metal surfaces
JPS6030542B2 (en) * 1982-06-21 1985-07-17 バンドー化学株式会社 Manufacturing method of toothed belt

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