JPH0197593U - - Google Patents
Info
- Publication number
- JPH0197593U JPH0197593U JP19323687U JP19323687U JPH0197593U JP H0197593 U JPH0197593 U JP H0197593U JP 19323687 U JP19323687 U JP 19323687U JP 19323687 U JP19323687 U JP 19323687U JP H0197593 U JPH0197593 U JP H0197593U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- heat
- fixing
- generating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19323687U JPH0197593U (en, 2012) | 1987-12-18 | 1987-12-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19323687U JPH0197593U (en, 2012) | 1987-12-18 | 1987-12-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0197593U true JPH0197593U (en, 2012) | 1989-06-29 |
Family
ID=31484044
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19323687U Pending JPH0197593U (en, 2012) | 1987-12-18 | 1987-12-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0197593U (en, 2012) |
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1987
- 1987-12-18 JP JP19323687U patent/JPH0197593U/ja active Pending