JPH0197573U - - Google Patents
Info
- Publication number
- JPH0197573U JPH0197573U JP19336087U JP19336087U JPH0197573U JP H0197573 U JPH0197573 U JP H0197573U JP 19336087 U JP19336087 U JP 19336087U JP 19336087 U JP19336087 U JP 19336087U JP H0197573 U JPH0197573 U JP H0197573U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- square
- circuit
- hole
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
- H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
- H01L2924/15157—Top view
Landscapes
- Structure Of Printed Boards (AREA)
- Die Bonding (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19336087U JPH0197573U (fi) | 1987-12-18 | 1987-12-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19336087U JPH0197573U (fi) | 1987-12-18 | 1987-12-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0197573U true JPH0197573U (fi) | 1989-06-29 |
Family
ID=31484154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19336087U Pending JPH0197573U (fi) | 1987-12-18 | 1987-12-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0197573U (fi) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011253835A (ja) * | 2010-05-31 | 2011-12-15 | Tdk-Lambda Corp | 電子回路用基板 |
| JP2012216575A (ja) * | 2011-03-31 | 2012-11-08 | Nec Toppan Circuit Solutions Inc | 部品内蔵印刷配線板及びその製造方法 |
| JP2016018842A (ja) * | 2014-07-07 | 2016-02-01 | 富士電機株式会社 | 半導体装置 |
| JP2016151666A (ja) * | 2015-02-17 | 2016-08-22 | キヤノン株式会社 | 走査光学装置 |
| US10281834B2 (en) | 2015-02-17 | 2019-05-07 | Canon Kabushiki Kaisha | Optical scanning device |
| JP2019139249A (ja) * | 2019-05-07 | 2019-08-22 | キヤノン株式会社 | 走査光学装置 |
-
1987
- 1987-12-18 JP JP19336087U patent/JPH0197573U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011253835A (ja) * | 2010-05-31 | 2011-12-15 | Tdk-Lambda Corp | 電子回路用基板 |
| JP2012216575A (ja) * | 2011-03-31 | 2012-11-08 | Nec Toppan Circuit Solutions Inc | 部品内蔵印刷配線板及びその製造方法 |
| JP2016018842A (ja) * | 2014-07-07 | 2016-02-01 | 富士電機株式会社 | 半導体装置 |
| JP2016151666A (ja) * | 2015-02-17 | 2016-08-22 | キヤノン株式会社 | 走査光学装置 |
| US10281834B2 (en) | 2015-02-17 | 2019-05-07 | Canon Kabushiki Kaisha | Optical scanning device |
| JP2019139249A (ja) * | 2019-05-07 | 2019-08-22 | キヤノン株式会社 | 走査光学装置 |