JPH0197566U - - Google Patents
Info
- Publication number
- JPH0197566U JPH0197566U JP19263987U JP19263987U JPH0197566U JP H0197566 U JPH0197566 U JP H0197566U JP 19263987 U JP19263987 U JP 19263987U JP 19263987 U JP19263987 U JP 19263987U JP H0197566 U JPH0197566 U JP H0197566U
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- bodies
- bendable
- connection device
- power module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19263987U JPH0197566U (ro) | 1987-12-21 | 1987-12-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19263987U JPH0197566U (ro) | 1987-12-21 | 1987-12-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0197566U true JPH0197566U (ro) | 1989-06-29 |
Family
ID=31483483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19263987U Pending JPH0197566U (ro) | 1987-12-21 | 1987-12-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0197566U (ro) |
-
1987
- 1987-12-21 JP JP19263987U patent/JPH0197566U/ja active Pending