JPH0197562U - - Google Patents

Info

Publication number
JPH0197562U
JPH0197562U JP19340487U JP19340487U JPH0197562U JP H0197562 U JPH0197562 U JP H0197562U JP 19340487 U JP19340487 U JP 19340487U JP 19340487 U JP19340487 U JP 19340487U JP H0197562 U JPH0197562 U JP H0197562U
Authority
JP
Japan
Prior art keywords
leads
semiconductor device
type semiconductor
lead insertion
sip type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19340487U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19340487U priority Critical patent/JPH0197562U/ja
Publication of JPH0197562U publication Critical patent/JPH0197562U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP19340487U 1987-12-22 1987-12-22 Pending JPH0197562U (US20050271598A1-20051208-C00001.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19340487U JPH0197562U (US20050271598A1-20051208-C00001.png) 1987-12-22 1987-12-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19340487U JPH0197562U (US20050271598A1-20051208-C00001.png) 1987-12-22 1987-12-22

Publications (1)

Publication Number Publication Date
JPH0197562U true JPH0197562U (US20050271598A1-20051208-C00001.png) 1989-06-29

Family

ID=31484192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19340487U Pending JPH0197562U (US20050271598A1-20051208-C00001.png) 1987-12-22 1987-12-22

Country Status (1)

Country Link
JP (1) JPH0197562U (US20050271598A1-20051208-C00001.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021111843A1 (ja) * 2019-12-03 2021-06-10 三洋電機株式会社 回路基板のハンダ付け構造

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021111843A1 (ja) * 2019-12-03 2021-06-10 三洋電機株式会社 回路基板のハンダ付け構造
US20220416370A1 (en) * 2019-12-03 2022-12-29 Sanyo Electric Co., Ltd. Circuit board soldering structure
US11996586B2 (en) 2019-12-03 2024-05-28 Panasonic Energy Co., Ltd. Circuit board soldering structure

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