JPH0196288U - - Google Patents
Info
- Publication number
- JPH0196288U JPH0196288U JP19333687U JP19333687U JPH0196288U JP H0196288 U JPH0196288 U JP H0196288U JP 19333687 U JP19333687 U JP 19333687U JP 19333687 U JP19333687 U JP 19333687U JP H0196288 U JPH0196288 U JP H0196288U
- Authority
- JP
- Japan
- Prior art keywords
- wire
- base portion
- wire holding
- protrusions
- holding jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19333687U JPH0196288U (OSRAM) | 1987-12-18 | 1987-12-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19333687U JPH0196288U (OSRAM) | 1987-12-18 | 1987-12-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0196288U true JPH0196288U (OSRAM) | 1989-06-26 |
Family
ID=31484134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19333687U Pending JPH0196288U (OSRAM) | 1987-12-18 | 1987-12-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0196288U (OSRAM) |
-
1987
- 1987-12-18 JP JP19333687U patent/JPH0196288U/ja active Pending
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