JPH0195823U - - Google Patents

Info

Publication number
JPH0195823U
JPH0195823U JP19236787U JP19236787U JPH0195823U JP H0195823 U JPH0195823 U JP H0195823U JP 19236787 U JP19236787 U JP 19236787U JP 19236787 U JP19236787 U JP 19236787U JP H0195823 U JPH0195823 U JP H0195823U
Authority
JP
Japan
Prior art keywords
acoustic wave
wave device
substrate
surface acoustic
registration request
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19236787U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19236787U priority Critical patent/JPH0195823U/ja
Publication of JPH0195823U publication Critical patent/JPH0195823U/ja
Pending legal-status Critical Current

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  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案のＳＡＷ装置の一実施例を示す
模式的な斜視図、第２図はバルク波の影響を説明
するためのＳＡＷ装置の断面図、第３図はバルク
波の除去に適した従来のＳＡＷ装置の構造を示す
断面図、第４図は第１図のＳＡＷ装置の粗面の拡
大断面図、第５図は一実施例のフイルタ特性を示
す図である。 １……ＬｉＮｂＯ３基板、２，３……電極、７
……凹凸部。 Fig. 1 is a schematic perspective view showing one embodiment of the SAW device of the present invention, Fig. 2 is a sectional view of the SAW device to explain the influence of bulk waves, and Fig. 3 is suitable for removing bulk waves. FIG. 4 is an enlarged sectional view of the rough surface of the SAW device of FIG. 1, and FIG. 5 is a diagram showing the filter characteristics of one embodiment. 1...LiNbO 3 substrate, 2,3...electrode, 7
...Uneven areas.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] １２８°Ｙカツトリチウムニオブレート基板表
面に入出力電極が形成された弾性表面波装置に於
いて、前記基板の裏面を該裏面に形成される凹凸
の隣接するピーク間の平均高さが約４．０〜６．
０μｍになるよう粗面加工したことを特徴とする
弾性表面波装置。 In a surface acoustic wave device in which input and output electrodes are formed on the surface of a 128° Y-cut lithium niobate substrate, the average height between adjacent peaks of the unevenness formed on the back surface of the substrate is about 4. 0-6.
A surface acoustic wave device characterized by having a surface roughened to 0 μm.
JP19236787U 1987-12-17 1987-12-17 Pending JPH0195823U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19236787U JPH0195823U (en) 1987-12-17 1987-12-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19236787U JPH0195823U (en) 1987-12-17 1987-12-17

Publications (1)

Publication Number Publication Date
JPH0195823U true JPH0195823U (en) 1989-06-26

Family

ID=31483229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19236787U Pending JPH0195823U (en) 1987-12-17 1987-12-17

Country Status (1)

Country Link
JP (1) JPH0195823U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5475290A (en) * 1977-11-29 1979-06-15 Fujitsu Ltd Linbo3 substrate for elastic surface wave

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5475290A (en) * 1977-11-29 1979-06-15 Fujitsu Ltd Linbo3 substrate for elastic surface wave

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