JPH0193771U - - Google Patents

Info

Publication number
JPH0193771U
JPH0193771U JP18862787U JP18862787U JPH0193771U JP H0193771 U JPH0193771 U JP H0193771U JP 18862787 U JP18862787 U JP 18862787U JP 18862787 U JP18862787 U JP 18862787U JP H0193771 U JPH0193771 U JP H0193771U
Authority
JP
Japan
Prior art keywords
conductor
layer
integrated circuit
thick film
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18862787U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18862787U priority Critical patent/JPH0193771U/ja
Publication of JPH0193771U publication Critical patent/JPH0193771U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP18862787U 1987-12-11 1987-12-11 Pending JPH0193771U (US20070167544A1-20070719-C00007.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18862787U JPH0193771U (US20070167544A1-20070719-C00007.png) 1987-12-11 1987-12-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18862787U JPH0193771U (US20070167544A1-20070719-C00007.png) 1987-12-11 1987-12-11

Publications (1)

Publication Number Publication Date
JPH0193771U true JPH0193771U (US20070167544A1-20070719-C00007.png) 1989-06-20

Family

ID=31479707

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18862787U Pending JPH0193771U (US20070167544A1-20070719-C00007.png) 1987-12-11 1987-12-11

Country Status (1)

Country Link
JP (1) JPH0193771U (US20070167544A1-20070719-C00007.png)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0334392A (ja) * 1989-06-29 1991-02-14 Semiconductor Energy Lab Co Ltd 配線基板
WO2022130816A1 (ja) * 2020-12-15 2022-06-23 株式会社村田製作所 伸縮性実装基板
US11659654B2 (en) 2018-12-27 2023-05-23 Murata Manufacturing Co., Ltd. Stretchable wiring board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5636176B2 (US20070167544A1-20070719-C00007.png) * 1978-09-08 1981-08-22
JPS5851597A (ja) * 1981-09-22 1983-03-26 富士通株式会社 クロスパタ−ンの形成方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5636176B2 (US20070167544A1-20070719-C00007.png) * 1978-09-08 1981-08-22
JPS5851597A (ja) * 1981-09-22 1983-03-26 富士通株式会社 クロスパタ−ンの形成方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0334392A (ja) * 1989-06-29 1991-02-14 Semiconductor Energy Lab Co Ltd 配線基板
US11659654B2 (en) 2018-12-27 2023-05-23 Murata Manufacturing Co., Ltd. Stretchable wiring board
WO2022130816A1 (ja) * 2020-12-15 2022-06-23 株式会社村田製作所 伸縮性実装基板

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