JPH0193758U - - Google Patents
Info
- Publication number
- JPH0193758U JPH0193758U JP18998087U JP18998087U JPH0193758U JP H0193758 U JPH0193758 U JP H0193758U JP 18998087 U JP18998087 U JP 18998087U JP 18998087 U JP18998087 U JP 18998087U JP H0193758 U JPH0193758 U JP H0193758U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- foil portion
- wiring board
- printed wiring
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims 3
- 230000000149 penetrating effect Effects 0.000 claims 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18998087U JPH0193758U ( ) | 1987-12-16 | 1987-12-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18998087U JPH0193758U ( ) | 1987-12-16 | 1987-12-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0193758U true JPH0193758U ( ) | 1989-06-20 |
Family
ID=31480984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18998087U Pending JPH0193758U ( ) | 1987-12-16 | 1987-12-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0193758U ( ) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008078435A1 (ja) * | 2006-12-22 | 2008-07-03 | Mitsubishi Electric Corporation | プリント配線基板及びその製造方法 |
-
1987
- 1987-12-16 JP JP18998087U patent/JPH0193758U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008078435A1 (ja) * | 2006-12-22 | 2008-07-03 | Mitsubishi Electric Corporation | プリント配線基板及びその製造方法 |
| US8278558B2 (en) | 2006-12-22 | 2012-10-02 | Mitsubishi Electric Corporation | Printed circuit board and method of producing the same |