JPH0193746U - - Google Patents
Info
- Publication number
- JPH0193746U JPH0193746U JP19040887U JP19040887U JPH0193746U JP H0193746 U JPH0193746 U JP H0193746U JP 19040887 U JP19040887 U JP 19040887U JP 19040887 U JP19040887 U JP 19040887U JP H0193746 U JPH0193746 U JP H0193746U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor device
- surface height
- lead frame
- inner lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 3
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19040887U JPH0193746U (xx) | 1987-12-14 | 1987-12-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19040887U JPH0193746U (xx) | 1987-12-14 | 1987-12-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0193746U true JPH0193746U (xx) | 1989-06-20 |
Family
ID=31481382
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19040887U Pending JPH0193746U (xx) | 1987-12-14 | 1987-12-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0193746U (xx) |
-
1987
- 1987-12-14 JP JP19040887U patent/JPH0193746U/ja active Pending